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XPC850SRZT50BU

Microprocessor MPC8xx Series PC850 256-BGA


  • Manufacturer: NXP USA Inc.
  • Origchip NO: 568-XPC850SRZT50BU
  • Package: 256-BGA
  • Datasheet: PDF
  • Stock: 358
  • Description: Microprocessor MPC8xx Series PC850 256-BGA (Kg)

Purchase & Inquiry

Transport

Purchase

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Means of Payment

For your convenience, we accept multiple payment methods in USD, including PayPal, Credit Card, and wire transfer.

RFQ (Request for Quotations)

It is recommended to request for quotations to get the latest prices and inventories about the part.
Our sales will reply to your request by email within 24 hours.

IMPORTANT NOTICE

1. You'll receive an order information email in your inbox. (Please remember to check the spam folder if you didn't hear from us).
2. Since inventories and prices may fluctuate to some extent, the sales manager is going to reconfirm the order and let you know if there are any updates.

Shipping Cost

Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.)
The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

Shipping Method

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.
transport

Details

Tags

Parameters
Package / Case 256-BGA
Operating Temperature 0°C~95°C TA
Packaging Tray
Published 2004
Series MPC8xx
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Base Part Number PC850
Speed 50MHz
Voltage - I/O 3.3V
Ethernet 10Mbps (1)
Number of Cores/Bus Width 1 Core 32-Bit
Graphics Acceleration No
RAM Controllers DRAM
USB USB 1.x (1)
Additional Interfaces HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART
Co-Processors/DSP Communications; CPM
RoHS Status Non-RoHS Compliant

XPC850SRZT50BU Overview


Shipping overseas is convenient since the embedded microprocessor is packed in 256-BGA. High reliability is achieved with advanced packaging method Tray. This CPU has 1 Core 32-Bit cores and 1 Core 32-Bit bus widths. Recognize operating temperatures around 0°C~95°C TA. In the series MPC8xx, it is found. A total of DRAM RAM controllers are used by this CPU. This microprocessor is equipped with an interface of HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART. In this CPU, I/O is set to 3.3V. Search PC850 for variants of the embedded microprocessor.

XPC850SRZT50BU Features



XPC850SRZT50BU Applications


There are a lot of NXP USA Inc. XPC850SRZT50BU Microprocessor applications.

  • Washing machine
  • Toasters
  • Industrial robot
  • Microwave ovens
  • Guidance-GPS
  • Computed Tomography (CT scan)
  • Industrial instrumentation devices
  • Hard drives
  • Fire alarms
  • Set-top boxes
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