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XCZU7EV-2FFVC1156E

0°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC EV Series 360 I/O

Manufacturer: Xilinx Inc.
Origchip NO: 903-XCZU7EV-2FFVC1156E
Package: 1156-BBGA, FCBGA
Datasheet: PDF
Stock: 302
Description: 0°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC EV Series 360 I/O(Kg)

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Details

Tags

Parameters
HTS Code	8542.31.00.01
Peak Reflow Temperature (Cel)	NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s)	NOT SPECIFIED
Number of I/O	360
Speed	533MHz, 600MHz, 1.3GHz
RAM Size	256KB
Core Processor	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Peripherals	DMA, WDT
Connectivity	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture	MCU, FPGA
Primary Attributes	Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
RoHS Status	ROHS3 Compliant
Factory Lead Time	11 Weeks
Package / Case	1156-BBGA, FCBGA
Operating Temperature	0°C~100°C TJ
Packaging	Tray
Published	2016
Series	Zynq® UltraScale+™ MPSoC EV
Pbfree Code	yes
Part Status	Active
Moisture Sensitivity Level (MSL)	4 (72 Hours)

This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).

A Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s) is built into this SoC.Manufacturer assigns package 1156-BBGA, FCBGA to this system on a chip.With 256KB RAM implemented, this SoC chip provides reliable operation.This SoC design employs the MCU, FPGA technique for its internal architecture.A system on chip SoC of this type belongs to the Zynq? UltraScale+? MPSoC EV series.Temperatures should be 0°C~100°C TJ on average for this SoC meaning.A significant feature of this SoC security is the combination of Zynq?UltraScale+? FPGA, 504K+ Logic Cells.An advanced Tray package houses this SoC system on a chip.As a whole, this SoC part is comprised of 360 inputs and outputs.