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XCZU4EV-1FBVB900I

-40°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC EV Series 204 I/O

Manufacturer: Xilinx Inc.
Origchip NO: 903-XCZU4EV-1FBVB900I
Package: 900-BBGA, FCBGA
Datasheet: PDF
Stock: 981
Description: -40°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC EV Series 204 I/O(Kg)

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Details

Tags

Parameters
Factory Lead Time	11 Weeks
Package / Case	900-BBGA, FCBGA
Operating Temperature	-40°C~100°C TJ
Packaging	Tray
Published	2016
Series	Zynq® UltraScale+™ MPSoC EV
Part Status	Active
Moisture Sensitivity Level (MSL)	4 (72 Hours)
HTS Code	8542.31.00.01
Peak Reflow Temperature (Cel)	NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s)	NOT SPECIFIED
Number of I/O	204
Speed	500MHz, 600MHz, 1.2GHz
RAM Size	256KB
Core Processor	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Peripherals	DMA, WDT
Connectivity	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture	MCU, FPGA
Primary Attributes	Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
RoHS Status	ROHS3 Compliant

This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).

This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).Its package is 900-BBGA, FCBGA.Users will enjoy reliable performance with this SoC chip, which has implemented 256KB RAM.This SoC design employs the MCU, FPGA technique for its internal architecture.Featured system on chip SoCs of the Zynq? UltraScale+? MPSoC EV series.It is expected that this SoC meaning will operate at -40°C~100°C TJ on average.One important thing to mark down is that this SoC meaning combines Zynq?UltraScale+? FPGA, 192K+ Logic Cells.In the state-of-the-art Tray package, this SoC system on a chip is housed.This SoC part contains a total of 204 I/Os in total.