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XCZU19EG-L2FFVC1760E

0°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC EG Series 512 I/O0.72V

Manufacturer: Xilinx Inc.
Origchip NO: 903-XCZU19EG-L2FFVC1760E
Package: 1760-BBGA, FCBGA
Datasheet: PDF
Stock: 601
Description: 0°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC EG Series 512 I/O0.72V (Kg)

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Details

Tags

Parameters
Factory Lead Time	11 Weeks
Package / Case	1760-BBGA, FCBGA
Surface Mount	YES
Operating Temperature	0°C~100°C TJ
Packaging	Tray
Published	2016
Series	Zynq® UltraScale+™ MPSoC EG
Part Status	Active
Moisture Sensitivity Level (MSL)	4 (72 Hours)
Additional Feature	ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
HTS Code	8542.31.00.01
Technology	CMOS
Terminal Position	BOTTOM
Terminal Form	BALL
Peak Reflow Temperature (Cel)	NOT SPECIFIED
Supply Voltage	0.72V
Time@Peak Reflow Temperature-Max (s)	NOT SPECIFIED
JESD-30 Code	R-PBGA-B1760
Supply Voltage-Max (Vsup)	0.742V
Supply Voltage-Min (Vsup)	0.698V
Number of I/O	512
Speed	533MHz, 600MHz, 1.3GHz
RAM Size	256KB
uPs/uCs/Peripheral ICs Type	MICROPROCESSOR CIRCUIT
Core Processor	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Peripherals	DMA, WDT
Connectivity	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture	MCU, FPGA
Primary Attributes	Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
RoHS Status	ROHS3 Compliant

This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).

There are Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processors in this SoC.Assigned with the package 1760-BBGA, FCBGA, this system on a chip comes from the manufacturer.Users will enjoy reliable performance with this SoC chip, which has implemented 256KB RAM.This SoC design employs the MCU, FPGA technique for its internal architecture.The system on a chip is part of the series Zynq? UltraScale+? MPSoC EG.It is recommended that this SoC meaning be operated at 0°C~100°C TJ on an average.A significant feature of this SoC security is the combination of Zynq?UltraScale+? FPGA, 1143K+ Logic Cells.A state-of-the-art Tray package houses this SoC system on a chip.512 I/Os in total are included in this SoC part.A 0.72V power supply should be used.There are voltages higher than 0.742V that should be avoided when using the SoCs wireless.This SoC system on a chip can run on a power supply that is at least 0.698V.MICROPROCESSOR CIRCUIT is its uPs/uCs/peripheral IC and is used in all of its peripheral SoC meanings.This SoC processor also includes ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY.