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XCZU19EG-L1FFVE1924I

-40°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC EG Series 668 I/O0.72V


  • Manufacturer: Xilinx Inc.
  • Origchip NO: 903-XCZU19EG-L1FFVE1924I
  • Package: 1924-BBGA, FCBGA
  • Datasheet: PDF
  • Stock: 360
  • Description: -40°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC EG Series 668 I/O0.72V (Kg)

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Details

Tags

Parameters
Factory Lead Time 11 Weeks
Package / Case 1924-BBGA, FCBGA
Surface Mount YES
Operating Temperature -40°C~100°C TJ
Packaging Tray
Published 2016
Series Zynq® UltraScale+™ MPSoC EG
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Additional Feature ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
HTS Code 8542.31.00.01
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 0.72V
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code R-PBGA-B1924
Supply Voltage-Max (Vsup) 0.742V
Supply Voltage-Min (Vsup) 0.698V
Number of I/O 668
Speed 500MHz, 600MHz, 1.2GHz
RAM Size 256KB
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Primary Attributes Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
RoHS Status ROHS3 Compliant

This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).


Based on the core processor(s) Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2, this SoC is built.Package 1924-BBGA, FCBGA is assigned to this system on a chip by the manufacturer.The 256KB RAM implementation of this SoC chip ensures efficient performance for users.This SoC design employs the MCU, FPGA technique for its internal architecture.It is part of the Zynq? UltraScale+? MPSoC EG series of system on a chips.The average operating temps for this SoC meaning should be -40°C~100°C TJ.This SoC security combines Zynq?UltraScale+? FPGA, 1143K+ Logic Cells, an important feature to keep in mind.This SoC system on a chip has been designed in a state-of-the-art Tray package.668 I/Os in total are included in this SoC part.A 0.72V power supply should be used.There are voltages higher than 0.742V that should be avoided when using the SoCs wireless.As a minimum, the power supply of the SoC system on a chip needs to be 0.698V.MICROPROCESSOR CIRCUIT served as its uPs, uCs, and peripheral integrated circuits.Moreover, this SoC processor also includes ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY as its additional features.

Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.


256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT
ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

There are a lot of Xilinx Inc.


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