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XCZU19EG-3FFVE1924E

0°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC EG Series 668 I/O

Manufacturer: Xilinx Inc.
Origchip NO: 903-XCZU19EG-3FFVE1924E
Package: 1924-BBGA, FCBGA
Datasheet: PDF
Stock: 490
Description: 0°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC EG Series 668 I/O(Kg)

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Parameters
Factory Lead Time	11 Weeks
Package / Case	1924-BBGA, FCBGA
Operating Temperature	0°C~100°C TJ
Packaging	Tray
Published	2016
Series	Zynq® UltraScale+™ MPSoC EG
Part Status	Active
Moisture Sensitivity Level (MSL)	4 (72 Hours)
HTS Code	8542.31.00.01
Peak Reflow Temperature (Cel)	NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s)	NOT SPECIFIED
Number of I/O	668
Speed	600MHz, 667MHz, 1.5GHz
RAM Size	256KB
Core Processor	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Peripherals	DMA, WDT
Connectivity	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture	MCU, FPGA
Primary Attributes	Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
RoHS Status	ROHS3 Compliant

This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).

Based on the core processor(s) Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2, this SoC is built.Package 1924-BBGA, FCBGA is assigned to this system on a chip by the manufacturer.A SoC chip with 256KB RAM is provided for users to enjoy reliable performance.When it comes to internal architecture, this SoC design employs the MCU, FPGA technique.Zynq? UltraScale+? MPSoC EG is the series number of this system on chip SoC.As a rule of thumb, the average operating temperature for this SoC meaning should be 0°C~100°C TJ.As one of the most important things to note is that this SoC security combines Zynq?UltraScale+? FPGA, 1143K+ Logic Cells together.An advanced Tray package houses this SoC system on a chip.Total I/Os on this SoC part are 668.