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XCZU17EG-3FFVD1760E

0°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC EG Series 308 I/O

Manufacturer: Xilinx Inc.
Origchip NO: 903-XCZU17EG-3FFVD1760E
Package: 1760-BBGA, FCBGA
Datasheet: PDF
Stock: 874
Description: 0°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC EG Series 308 I/O(Kg)

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Details

Tags

Parameters
Factory Lead Time	11 Weeks
Package / Case	1760-BBGA, FCBGA
Operating Temperature	0°C~100°C TJ
Packaging	Tray
Published	2016
Series	Zynq® UltraScale+™ MPSoC EG
Part Status	Active
Moisture Sensitivity Level (MSL)	4 (72 Hours)
HTS Code	8542.31.00.01
Peak Reflow Temperature (Cel)	NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s)	NOT SPECIFIED
Number of I/O	308
Speed	600MHz, 667MHz, 1.5GHz
RAM Size	256KB
Core Processor	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Peripherals	DMA, WDT
Connectivity	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture	MCU, FPGA
Primary Attributes	Zynq®UltraScale+™ FPGA, 926K+ Logic Cells
RoHS Status	ROHS3 Compliant

This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).

This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).According to the manufacturer, this system on a chip has a package of 1760-BBGA, FCBGA.A SoC chip with 256KB RAM is provided for users to enjoy reliable performance.In terms of internal architecture, this SoC design uses the MCU, FPGA method.Featured system on chip SoCs of the Zynq? UltraScale+? MPSoC EG series.It is expected that this SoC meaning will operate at 0°C~100°C TJ on average.This SoC security combines Zynq?UltraScale+? FPGA, 926K+ Logic Cells, an important feature to keep in mind.It comes in a state-of-the-art Tray package.308 I/Os are included in this SoC part.