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XCZU17EG-2FFVC1760I

-40°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC EG Series 512 I/O

Manufacturer: Xilinx Inc.
Origchip NO: 903-XCZU17EG-2FFVC1760I
Package: 1760-BBGA, FCBGA
Datasheet: PDF
Stock: 732
Description: -40°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC EG Series 512 I/O(Kg)

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Details

Tags

Parameters
Factory Lead Time	11 Weeks
Package / Case	1760-BBGA, FCBGA
Operating Temperature	-40°C~100°C TJ
Packaging	Tray
Published	2016
Series	Zynq® UltraScale+™ MPSoC EG
Part Status	Active
Moisture Sensitivity Level (MSL)	4 (72 Hours)
HTS Code	8542.31.00.01
Peak Reflow Temperature (Cel)	NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s)	NOT SPECIFIED
Number of I/O	512
Speed	533MHz, 600MHz, 1.3GHz
RAM Size	256KB
Core Processor	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Peripherals	DMA, WDT
Connectivity	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture	MCU, FPGA
Primary Attributes	Zynq®UltraScale+™ FPGA, 926K+ Logic Cells
RoHS Status	ROHS3 Compliant

This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).

Based on the core processor(s) Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2, this SoC is built.It has been assigned a package 1760-BBGA, FCBGA by its manufacturer for this system on a chip.With 256KB RAM implemented, this SoC chip provides users with a high level of performance.Internally, this SoC design uses the MCU, FPGA technique.It is a member of the Zynq? UltraScale+? MPSoC EG series.This SoC meaning should have an average operating temperature of -40°C~100°C TJ.This SoC security combines Zynq?UltraScale+? FPGA, 926K+ Logic Cells and that is something to note.It comes in a state-of-the-art Tray package.512 I/Os are available in this SoC part.