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XC7Z045-1FBG676I

676 Terminations-40°C~100°C TJ XC7Z045 System On ChipZynq?-7000 Series 130 I/O1V


  • Manufacturer: Xilinx Inc.
  • Origchip NO: 903-XC7Z045-1FBG676I
  • Package: 676-BBGA, FCBGA
  • Datasheet: PDF
  • Stock: 688
  • Description: 676 Terminations-40°C~100°C TJ XC7Z045 System On ChipZynq?-7000 Series 130 I/O1V (Kg)

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Details

Tags

Parameters
Number of Terminations 676
ECCN Code 3A991.D
Terminal Finish Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
HTS Code 8542.39.00.01
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 245
Supply Voltage 1V
Terminal Pitch 1mm
Frequency 667MHz
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number XC7Z045
JESD-30 Code S-PBGA-B676
Operating Supply Voltage 1V
Supply Voltage-Max (Vsup) 1.05V
Interface CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
Number of I/O 130
RAM Size 256KB
Memory Type ROMless
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Peripherals DMA
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Data Bus Width 32b
Core Architecture ARM
Boundary Scan YES
Speed Grade -1
RAM (words) 256000
Primary Attributes Kintex™-7 FPGA, 350K Logic Cells
Bus Compatibility CAN; ETHERNET; I2C; SPI; UART; USB
Height Seated (Max) 2.54mm
Length 27mm
Radiation Hardening No
RoHS Status ROHS3 Compliant
Factory Lead Time 10 Weeks
Contact Plating Copper, Silver, Tin
Package / Case 676-BBGA, FCBGA
Surface Mount YES
Operating Temperature -40°C~100°C TJ
Packaging Tray
Published 2009
Series Zynq®-7000
JESD-609 Code e1
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)

This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).


A Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s) is built into this SoC.Its package is 676-BBGA, FCBGA.The 256KB RAM implementation of this SoC chip ensures efficient performance for users.The internal architecture of this SoC design utilizes the MCU, FPGA technique.A system on chip SoC of this type belongs to the Zynq?-7000 series.It is recommended that this SoC meaning be operated at -40°C~100°C TJ on an average.As one of the most important things to note is that this SoC security combines Kintex?-7 FPGA, 350K Logic Cells together.In the state-of-the-art Tray package, this SoC system on a chip is housed.130 I/Os in total are included in this SoC part.It is recommended to use a 1V power supply.In the SoCs wireless, voltages above 1.05V are considered unsafe.Having 676 terminations in total makes system on a chip possible.It is possible to find system on chips that are similar in specs and purpose by searching for XC7Z045.It operates at a frequency of 667MHz.In terms of core architecture, the SoC meaning relies on ARM.

Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.


256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM

There are a lot of Xilinx Inc.


XC7Z045-1FBG676I System On Chip (SoC) applications.

  • Avionics
  • Remote control
  • Vending machines
  • Medical
  • Vending machines
  • Efficient hardware for training of neural networks
  • Automated sorting equipment
  • Networked sensors
  • ARM Cortex M4 microcontroller
  • Industrial AC-DC
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