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XC7Z035-2FFG900E

900 Terminations0°C~100°C TJ System On ChipZynq?-7000 Series 130 I/O1V Min 950mV VMax 1.05V V


  • Manufacturer: Xilinx Inc.
  • Origchip NO: 903-XC7Z035-2FFG900E
  • Package: 900-BBGA, FCBGA
  • Datasheet: PDF
  • Stock: 186
  • Description: 900 Terminations0°C~100°C TJ System On ChipZynq?-7000 Series 130 I/O1V Min 950mV VMax 1.05V V(Kg)

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Details

Tags

Parameters
Factory Lead Time 10 Weeks
Contact Plating Copper, Silver, Tin
Mount Surface Mount
Package / Case 900-BBGA, FCBGA
Operating Temperature 0°C~100°C TJ
Packaging Tray
Published 2010
Series Zynq®-7000
JESD-609 Code e1
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Number of Terminations 900
ECCN Code 3A991.D
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Additional Feature PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 245
Supply Voltage 1V
Terminal Pitch 1mm
Frequency 800MHz
Time@Peak Reflow Temperature-Max (s) 30
JESD-30 Code S-PBGA-B900
Interface CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
Max Supply Voltage 1.05V
Min Supply Voltage 950mV
Number of I/O 130
RAM Size 256KB
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Peripherals DMA
Propagation Delay 100 ps
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Core Architecture ARM
Boundary Scan YES
Speed Grade 2
Primary Attributes Kintex™-7 FPGA, 275K Logic Cells
Number of Registers 343800
Height Seated (Max) 3.35mm
Length 31mm
Width 31mm
RoHS Status ROHS3 Compliant

This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).


There are Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processors in this SoC.It has been assigned a package 900-BBGA, FCBGA by its manufacturer for this system on a chip.As this SoC chip has 256KB RAM implemented, it provides reliable performance to its users.Internally, this SoC design uses the MCU, FPGA technique.It is a member of the Zynq?-7000 series.Typical operating temperatures for this SoC meaning should be 0°C~100°C TJ.A key point to note is that this SoC security combines Kintex?-7 FPGA, 275K Logic Cells.An advanced Tray package houses this SoC system on a chip.130 I/Os in total are included in this SoC part.As a rule of thumb, it is advised to use a power supply with a value of 1V.There are 900 terminations in total and that really benefits system on a chip.A wireless SoC that operates at a frequency of 800MHz is what the wireless SoC does.There are a number of features to this SoC meaning which are based on the core architecture of ARM.Aside from that, this SoC processor is also equipped with some additional features that are present in PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY.There is a maximum supply voltage of 1.05V.At least 950mV power is delivered to it.

Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.


256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY

There are a lot of Xilinx Inc.


XC7Z035-2FFG900E System On Chip (SoC) applications.

  • Temperature
  • POS Terminals
  • Networked sensors
  • Digital Media
  • Avionics
  • Servo drive control module
  • Transmitters
  • Mobile computing
  • Mouse
  • Industrial sectors
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