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XC17S100AVOG8C

Surface Mount Tray Configuration Proms for FPGAs 3 (168 Hours) OTP Obsolete XC17S100A

Manufacturer: Xilinx Inc.
Origchip NO: 903-XC17S100AVOG8C
Package: 8-SOIC (0.154, 3.90mm Width)
Datasheet: PDF
Stock: 762
Description: Surface Mount Tray Configuration Proms for FPGAs 3 (168 Hours) OTP Obsolete XC17S100A (Kg)

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Details

Tags

Parameters
Mounting Type	Surface Mount
Package / Case	8-SOIC (0.154, 3.90mm Width)
Number of Pins	8
Operating Temperature	0°C~70°C
Packaging	Tray
Published	1999
Pbfree Code	yes
Part Status	Obsolete
Moisture Sensitivity Level (MSL)	3 (168 Hours)
ECCN Code	3A991.B.1
Voltage - Supply	3V~3.6V
Base Part Number	XC17S100A
Pin Count	8
Operating Supply Voltage	3.3V
Programmable Type	OTP
Density	1 Mb
Radiation Hardening	No
RoHS Status	RoHS Compliant

XC17S100AVOG8C Overview

FPGA uses a neat 8-SOIC (0.154, 3.90mm Width) package.External packaging of type Tray.Qualified to perform a variety of tasks within the 0°C~70°C environment.The OTP programming language can be used to program it.This device is fed with a voltage of 3V~3.6V which is applied to it.The memory device is mounted in Surface Mount.XC17S100A will give you other related parts.FPGA has pins on the 8 axis.As part of the package, the part comes with a set of 8 pins.Using 3.3V on the part before use will help the part run safely and reliably in a circuit.