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XC1765ELPD8C

Through Hole 65kb Mb Tube Configuration Proms for FPGAs Not Applicable OTP Obsolete XC1765EL not_compliant


  • Manufacturer: Xilinx Inc.
  • Origchip NO: 903-XC1765ELPD8C
  • Package: 8-DIP (0.300, 7.62mm)
  • Datasheet: PDF
  • Stock: 334
  • Description: Through Hole 65kb Mb Tube Configuration Proms for FPGAs Not Applicable OTP Obsolete XC1765EL not_compliant (Kg)

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Details

Tags

Parameters
Standby Current-Max 0.00005A
Memory Density 65536 bit
Parallel/Serial SERIAL
I/O Type COMMON
Memory IC Type CONFIGURATION MEMORY
Height Seated (Max) 4.5974mm
Length 9.3599mm
Width 7.62mm
RoHS Status Non-RoHS Compliant
Lead Free Contains Lead
Mounting Type Through Hole
Package / Case 8-DIP (0.300, 7.62mm)
Surface Mount NO
Number of Pins 8
Operating Temperature 0°C~70°C
Packaging Tube
Published 2000
JESD-609 Code e0
Part Status Obsolete
Moisture Sensitivity Level (MSL) Not Applicable
Number of Terminations 8
ECCN Code EAR99
Additional Feature USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS
Technology CMOS
Voltage - Supply 3V~3.6V
Terminal Position DUAL
Peak Reflow Temperature (Cel) 225
Number of Functions 1
Supply Voltage 3.3V
Terminal Pitch 2.54mm
Reach Compliance Code not_compliant
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number XC1765EL
Pin Count 8
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 3.6V
Power Supplies 3.3V
Supply Voltage-Min (Vsup) 3V
Programmable Type OTP
Memory Size 65kb
Operating Mode SYNCHRONOUS
Clock Frequency 2.5MHz
Supply Current-Max 0.005mA
Organization 64KX1
Output Characteristics 3-STATE
Memory Width 1

XC1765ELPD8C Overview


FPGA uses a neat 8-DIP (0.300, 7.62mm) package.Packaging for Tube.Qualified to operate within 0°C~70°C.This device can be programmed using OTP.With a voltage of 3V~3.6V, it is powered.The memory device is mounted in the Through Hole position.Data storage is limited to a size of 65kb bytes.Other related parts can be found by searching "XC1765EL".There is a voltage requirement of 3.3V for supplying it with power.Different functions are associated with 8 terminations.A maximum voltage of 3.6V can be applied to this memory device.An operating voltage of 3V is required in order to supply the device.This is a CONFIGURATION MEMORY memory chip.The reflow soldering process should be done at a temperature no higher than 225.The 8 pins are on the board.Data is transmitted in this memory using a SERIAL process.An operating voltage of 0.005mA is allowed for the memory chip.The part comes with a set of 8 pins.Taking the speed of the IC into consideration, this is a memory IC that can work at a frequency of 2.5MHz.This memory has a COMMON configuration for its I/O.Memory is recommended that a 3.3V power supply be used.For better customer service, USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS is added.

XC1765ELPD8C Features


Operating temperature: 0°C~70°C.
OTP program capability.
CONFIGURATION MEMORY memory IC.
SERIAL processing.
COMMON I/O equipped.

XC1765ELPD8C Applications


There are a lot of Xilinx Inc. XC1765ELPD8C applications of configuration proms for FPGAs.

  • graphics card
  • main computer memory
  • mainframes
  • Cache memory
  • telecommunications
  • personal computers
  • cell phones
  • personal digital assistants
  • hard disk drive (HDD)
  • data buffer
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