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XC1701PC20C

Surface Mount 1Mb Mb Tube Configuration Proms for FPGAs 3 (168 Hours) OTP Obsolete unknown

Manufacturer: Rochester Electronics, LLC
Origchip NO: 699-XC1701PC20C
Package: 20-LCC (J-Lead)
Datasheet: PDF
Stock: 306
Description: Surface Mount 1Mb Mb Tube Configuration Proms for FPGAs 3 (168 Hours) OTP Obsolete unknown (Kg)

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Details

Tags

Parameters
Mounting Type	Surface Mount
Package / Case	20-LCC (J-Lead)
Surface Mount	YES
Operating Temperature	0°C~70°C
Packaging	Tube
JESD-609 Code	e0
Pbfree Code	no
Part Status	Obsolete
Moisture Sensitivity Level (MSL)	3 (168 Hours)
Number of Terminations	20
Terminal Finish	TIN LEAD
Additional Feature	USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS
Technology	CMOS
Voltage - Supply	4.75V~5.25V
Terminal Position	QUAD
Terminal Form	J BEND
Peak Reflow Temperature (Cel)	225
Number of Functions	1
Supply Voltage	5V
Terminal Pitch	1.27mm
Reach Compliance Code	unknown
Time@Peak Reflow Temperature-Max (s)	30
Pin Count	20
JESD-30 Code	S-PQCC-J20
Qualification Status	COMMERCIAL
Supply Voltage-Max (Vsup)	5.25V
Supply Voltage-Min (Vsup)	4.75V
Programmable Type	OTP
Memory Size	1Mb
Operating Mode	SYNCHRONOUS
Organization	1MX1
Memory Width	1
Memory Density	1048576 bit
Parallel/Serial	SERIAL
Memory IC Type	CONFIGURATION MEMORY
Height Seated (Max)	4.572mm
Length	8.9662mm
Width	8.9662mm
RoHS Status	Non-RoHS Compliant

XC1701PC20C Overview

FPGA uses a neat 20-LCC (J-Lead) package.Packaging for the external environment.Qualified to operate within 0°C~70°C.OTP is the program that allows it to be programmed.With a voltage of 4.75V~5.25V, it is powered.Surface Mount is the mounting position of this memory device.Data storage is limited to a size of 1Mb bytes.5V is the voltage it requires as a supply.20 terminations with different functions.FPGA is possible to use this memory device at a maximum voltage of 5.25V.FPGA is essential that a minimum voltage of 4.75V be supplied to the device in order for FPGA to function.Using the CONFIGURATION MEMORY memory chip, we can store data.In reflow soldering, the temperature should be controlled to a maximum of 225 degrees during the process.A SERIAL-processing method is used to transfer data through this memory.Parts come with 20 pins.The inclusion of USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS will help customers better meet their needs.