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XC1701LPD8C

Through Hole 1Mb Mb Tube Configuration Proms for FPGAs Not Applicable OTP Obsolete XC1701L not_compliant


  • Manufacturer: Xilinx Inc.
  • Origchip NO: 903-XC1701LPD8C
  • Package: 8-DIP (0.300, 7.62mm)
  • Datasheet: PDF
  • Stock: 350
  • Description: Through Hole 1Mb Mb Tube Configuration Proms for FPGAs Not Applicable OTP Obsolete XC1701L not_compliant (Kg)

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Details

Tags

Parameters
Mounting Type Through Hole
Package / Case 8-DIP (0.300, 7.62mm)
Surface Mount NO
Number of Pins 8
Operating Temperature 0°C~70°C
Packaging Tube
Published 2000
JESD-609 Code e0
Pbfree Code no
Part Status Obsolete
Moisture Sensitivity Level (MSL) Not Applicable
Number of Terminations 8
ECCN Code EAR99
Additional Feature USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS
Technology CMOS
Voltage - Supply 3V~3.6V
Terminal Position DUAL
Peak Reflow Temperature (Cel) 225
Number of Functions 1
Supply Voltage 3.3V
Terminal Pitch 2.54mm
Reach Compliance Code not_compliant
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number XC1701L
Pin Count 8
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 3.6V
Power Supplies 3.3V
Supply Voltage-Min (Vsup) 3V
Programmable Type OTP
Memory Size 1Mb
Operating Mode SYNCHRONOUS
Clock Frequency 15MHz
Supply Current-Max 0.01mA
Organization 1MX1
Output Characteristics 3-STATE
Memory Width 1
Standby Current-Max 0.00005A
Parallel/Serial SERIAL
I/O Type COMMON
Memory IC Type CONFIGURATION MEMORY
Height Seated (Max) 4.5974mm
Length 9.3599mm
Width 7.62mm
RoHS Status Non-RoHS Compliant
Lead Free Contains Lead

XC1701LPD8C Overview


There is a neat 8-DIP (0.300, 7.62mm) package that is used in this program.Packaging for the external environment.Qualified to perform a variety of tasks within the 0°C~70°C environment.This device can be programmed using OTP.With a voltage of 3V~3.6V, it is powered.The memory device is mounted in Through Hole.There is a limit of 1Mb MB for the amount of data that can be stored.To find other similar parts, search for "XC1701L".3.3V is the required supply voltage.Various functions can be applied to 8 terminations.FPGA is possible to use this memory device at a maximum voltage of 3.6V.FPGA is essential that a minimum voltage of 3V be supplied to the device in order for FPGA to function.A CONFIGURATION MEMORY memory chip is shown here.In reflow soldering procedure, the temperature should be controlled to no higher than 225.FPGA is equipped wFPGAh 8 pins.In this memory, data is transmitted using the SERIAL process.In order for a memory chip to operate, it must not be subjected to a voltage greater than 0.01mA.Parts include 8 pins.I would like to mention that this is a memory IC that will be able to work at a 15MHz frequency, so I will mention that.The memory's I/O is configured to be COMMON in terms of its configuration.A power supply that is rated at 3.3V is recommended for use with this product.For better customer service, USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS is added.

XC1701LPD8C Features


Operating temperature: 0°C~70°C.
OTP program capability.
CONFIGURATION MEMORY memory IC.
SERIAL processing.
COMMON I/O equipped.

XC1701LPD8C Applications


There are a lot of Xilinx Inc. XC1701LPD8C applications of configuration proms for FPGAs.

  • main computer memory
  • eSRAM
  • telecommunications
  • graphics card
  • hard disk drive (HDD)
  • multimedia computers
  • Camcorders
  • Cache memory
  • data buffer
  • nonvolatile BIOS memory
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