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VSC7420XJQ-02

Telecom device1 Circuits

Manufacturer: Microchip Technology
Origchip NO: 536-VSC7420XJQ-02
Package: TQFP
Datasheet: PDF
Stock: 336
Description: Telecom device1 Circuits(Kg)

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FedEx International, 5-7 business days.

The following are some common countries' logistic time.
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Details

Tags

Parameters
Lifecycle Status	NOT RECOMMENDED FOR NEW DESIGN (Last Updated: 1 month ago)
Mounting Type	Surface Mount
Package / Case	TQFP
Supplier Device Package	302-TQFP (24x24)
Packaging	Tray
Series	SparX™-III-10um
Part Status	Not For New Designs
Moisture Sensitivity Level (MSL)	4 (72 Hours)
Max Operating Temperature	125°C
Min Operating Temperature	0°C
Voltage - Supply	1V
Function	Ethernet Switch
Interface	Serial
Number of Circuits	1
RoHS Status	ROHS3 Compliant
Lead Free	Lead Free

VSC7420XJQ-02 Overview

The TQFP package reduces the amount of space on a board.A Tray-packing method is used to pack telecommunications equipment.A Surface Mount mounting type is used.1 circuits make up this telecom IC .When 1V is supplied wtelecom IC's efficiencyh power, efficiency can be improved.A number of similar functions of the telecommunication product can be provided by it as with those of electronic parts under the SparX?-III-10um series.For normal operation, the temperature is set at 0°C minimum.It is necessary to set the temperature at the maximum value of 125°C for the telecom IC to function normally.