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SE97TL,147

8-XFDFN Exposed Pad Thermal Management

Manufacturer: NXP USA Inc.
Origchip NO: 568-SE97TL,147
Package: 8-XFDFN Exposed Pad
Datasheet: PDF
Stock: 837
Description: 8-XFDFN Exposed Pad Thermal Management (Kg)

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Shipping Cost

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The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

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FedEx International, 5-7 business days.

The following are some common countries' logistic time.
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Details

Tags

Parameters
Mounting Type	Surface Mount
Package / Case	8-XFDFN Exposed Pad
Operating Temperature	-40°C~125°C
Packaging	Tape & Reel (TR)
Published	2009
Part Status	Obsolete
Moisture Sensitivity Level (MSL)	1 (Unlimited)
Voltage - Supply	3V~3.6V
Reach Compliance Code	unknown
Base Part Number	SE97
Function	Temp Monitoring System (Sensor), DIMM DDR Memory
Output Type	I2C/SMBus
Accuracy	±3°C(Max)
Topology	ADC (Sigma Delta), Comparator, Register Bank
Sensor Type	Internal
Output Alarm	Yes
Sensing Temperature	-40°C~125°C
RoHS Status	ROHS3 Compliant

SE97TL,147 Overview

As per Tape & Reel (TR)'s materials, packaged.A Type I2C/SMBus output is used.Its low package cost makes it familiar to those in the electronics industry.As Temp Monitoring System (Sensor), DIMM DDR Memory, it is capable of acting.The device will be mounted by pressing Surface Mount.Internal-type is incorporated in it.Maintaining a temperature of -40°C~125°C is necessary to ensure reliable operation.3V~3.6V Supply Voltage must be provided to ensure normal operation.Temperature can be measured in -40°C~125°C's sensing area.A Base Part Number (SE97) identifies a particular type, regardless of its package, its temperature, or any other variation.