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PEF 22623 E V2.1

PEF22623 Telecom device1 Circuits


  • Manufacturer: Infineon Technologies
  • Origchip NO: 376-PEF 22623 E V2.1
  • Package: 256-LBGA
  • Datasheet: -
  • Stock: 451
  • Description: PEF22623 Telecom device1 Circuits(Kg)

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FedEx International, 5-7 business days.

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Details

Tags

Parameters
Mounting Type Surface Mount
Package / Case 256-LBGA
Supplier Device Package P-LBGA-256
Packaging Tray
Series SOCRATES™
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Base Part Number PEF22623
Function One Chip Rate Adaptive Transceiver
Interface SHDSL
Number of Circuits 1
RoHS Status Non-RoHS Compliant

PEF 22623 E V2.1 Overview


Space is saved on the board by using the 256-LBGA package.In order to pack telecommunications equipment, Tray is used.The mounting type of this telecom circuit is Surface Mount.There are 1 circuits in this telecom IC .By using telecom switching's base part number of PEF22623, it is possible to find more related parts.With the SOCRATES? series electronic parts, it can perform similar functions of the telecommunication product .

PEF 22623 E V2.1 Features


Available in the 256-LBGA package

PEF 22623 E V2.1 Applications


There are a lot of Infineon Technologies PEF 22623 E V2.1 Telecom applications.

  • Digital Access Cross-connect System (DACs)
  • Digital cross connects (DSX-1)
  • T1 Rates PCM Line Interface
  • ISDN Primary Rate Interface
  • Inverse Multiplexing for ATM (IMA) Wireless Base Stations
  • Interfaces to SONET STS-1 Networks
  • T3 channelized access concentrators
  • T1/E1/J1 Multiplexer and Channel Banks
  • Cross Connects
  • Digital access cross connects
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