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PEF 22554 HT V3.1

PEF22554 Telecom device2 Circuits


  • Manufacturer: Infineon Technologies
  • Origchip NO: 376-PEF 22554 HT V3.1
  • Package: 144-LQFP
  • Datasheet: PDF
  • Stock: 658
  • Description: PEF22554 Telecom device2 Circuits(Kg)

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FedEx International, 5-7 business days.

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Details

Tags

Parameters
Mounting Type Surface Mount
Package / Case 144-LQFP
Supplier Device Package P-TQFP-144-6
Operating Temperature -40°C~85°C
Packaging Tray
Series QuadFALC™
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Power (Watts) 150mW
Voltage - Supply 1.8V 3.3V
Base Part Number PEF22554
Function Framer, Line Interface Unit (LIU)
Interface E1, J1, SCI, SPI, T1
Number of Circuits 2

PEF 22554 HT V3.1 Overview


The 144-LQFP package reduces the amount of space on a board.Telecommunications equipment is packed using the Tray method.Surface Mount is used as telecommunications equipment mounting type.Telecom circuit is made up of 2 circuits.When the voltage for 1.8V 3.3V is provided, improved efficiency can be achieved.-40°C~85°C is the operating temperature that can be set for reliable performance.The PEF22554 base part number can be used to find more related parts.With the QuadFALC? series electronic parts, it can provide a lot of similar features.

PEF 22554 HT V3.1 Features


Available in the 144-LQFP package

PEF 22554 HT V3.1 Applications


There are a lot of Infineon Technologies PEF 22554 HT V3.1 Telecom applications.

  • E1 Rates PCM Line Interface
  • E1 Network Equipment
  • Cable Telephony
  • PCM channel bank
  • Remote wireless modules
  • Fault Tolerant Systems
  • Multichannel DS1 Test Equipment
  • Digital Cross-connect Systems (DCS)
  • High-Density T1/E1/J1 interfaces for Multiplexers
  • DECT (Digital European Cordless Telephone) Base
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