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PEF 22552 E V1.1

PEF22552 Telecom device2 Circuits

Manufacturer: Infineon Technologies
Origchip NO: 376-PEF 22552 E V1.1
Package: 160-LBGA
Datasheet: PDF
Stock: 939
Description: PEF22552 Telecom device2 Circuits(Kg)

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Details

Tags

Parameters
Mounting Type	Surface Mount
Package / Case	160-LBGA
Supplier Device Package	P/PG-LBGA-160-1
Operating Temperature	-40°C~85°C
Packaging	Tray
Series	DualFALC™
Part Status	Obsolete
Moisture Sensitivity Level (MSL)	3 (168 Hours)
Voltage - Supply	1.8V 3.3V
Base Part Number	PEF22552
Function	Framer, Line Interface Unit (LIU)
Interface	E1, HDLC, J1, T1
Number of Circuits	2
RoHS Status	Non-RoHS Compliant

PEF 22552 E V1.1 Overview

A 160-LBGA package is used to reduce board space requirements.Packing is done according to the Tray method.The mounting type of this telecom circuit is Surface Mount.A 2-circuit composes this telecom IC .Providing 1.8V 3.3V wtelecom IC's efficiencyh the correct supply voltage will improve efficiency.-40°C~85°C is the operating temperature that can be set for reliable performance.By using telecom switching's base part number of PEF22552, it is possible to find more related parts.A number of similar functions of the telecommunication product can be provided by it as with those of electronic parts under the DualFALC? series.