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MPC860TCZQ50D4

1.27mm 3.3V 32-bit Microprocessor MPC8xx Series MPC860 3.3V 357-BBGA

Manufacturer: NXP USA Inc.
Origchip NO: 568-MPC860TCZQ50D4
Package: 357-BBGA
Datasheet: PDF
Stock: 285
Description: 1.27mm 3.3V 32-bit Microprocessor MPC8xx Series MPC860 3.3V 357-BBGA (Kg)

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Details

Tags

Parameters
Factory Lead Time	12 Weeks
Package / Case	357-BBGA
Surface Mount	YES
Operating Temperature	-40°C~95°C TA
Packaging	Tray
Published	1995
Series	MPC8xx
JESD-609 Code	e0
Part Status	Not For New Designs
Moisture Sensitivity Level (MSL)	3 (168 Hours)
Number of Terminations	357
ECCN Code	3A991.A.2
Terminal Finish	Tin/Lead/Silver (Sn/Pb/Ag)
HTS Code	8542.31.00.01
Subcategory	Microprocessors
Technology	CMOS
Terminal Position	BOTTOM
Terminal Form	BALL
Peak Reflow Temperature (Cel)	245
Supply Voltage	3.3V
Terminal Pitch	1.27mm
Time@Peak Reflow Temperature-Max (s)	30
Base Part Number	MPC860
JESD-30 Code	S-PBGA-B357
Supply Voltage-Max (Vsup)	3.465V
Power Supplies	3.3V
Supply Voltage-Min (Vsup)	3.135V
Speed	50MHz
uPs/uCs/Peripheral ICs Type	MICROPROCESSOR, RISC
Clock Frequency	50MHz
Bit Size	32
Address Bus Width	32
Boundary Scan	YES
Low Power Mode	YES
External Data Bus Width	32
Format	FIXED POINT
Integrated Cache	YES
Voltage - I/O	3.3V
Ethernet	10Mbps (4), 10/100Mbps (1)
Number of Cores/Bus Width	1 Core 32-Bit
Graphics Acceleration	No
RAM Controllers	DRAM
Additional Interfaces	HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Co-Processors/DSP	Communications; CPM
Height Seated (Max)	2.52mm
Length	25mm
RoHS Status	Non-RoHS Compliant

MPC860TCZQ50D4 Description

The MPC860TCZQ50D4 PowerQUICC? offers an integrated processor and peripheral solution that can be used in a variety of communications and networking controller applications. The MPC860TCZQ50D4 delivers higher performance in all areas of device operation including flexibility, extensions in capability, and integration provides lower power consumption than traditional architectures and is backed by strong third-party tool support through our design alliance program.