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M2S090T-1FGG676I

676 Terminations-40°C~100°C TJ M2S090T System On ChipSmartFusion?2 Series 425 I/O1.2V


  • Manufacturer: Microsemi Corporation
  • Origchip NO: 523-M2S090T-1FGG676I
  • Package: 676-BGA
  • Datasheet: PDF
  • Stock: 113
  • Description: 676 Terminations-40°C~100°C TJ M2S090T System On ChipSmartFusion?2 Series 425 I/O1.2V (Kg)

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Details

Tags

Parameters
Factory Lead Time 10 Weeks
Lifecycle Status IN PRODUCTION (Last Updated: 3 weeks ago)
Package / Case 676-BGA
Surface Mount YES
Operating Temperature -40°C~100°C TJ
Packaging Tray
Published 2009
Series SmartFusion®2
JESD-609 Code e3
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 676
Terminal Finish MATTE TIN
HTS Code 8542.39.00.01
Subcategory Field Programmable Gate Arrays
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1.2V
Terminal Pitch 1mm
Frequency 166MHz
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Base Part Number M2S090T
JESD-30 Code S-PBGA-B676
Number of Outputs 425
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.26V
Power Supplies 1.2V
Supply Voltage-Min (Vsup) 1.14V
Interface CAN, Ethernet, I2C, SPI, UART, USART, USB
Number of I/O 425
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DDR, PCIe, SERDES
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture MCU, FPGA
Number of Inputs 425
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Core Architecture ARM
Primary Attributes FPGA - 90K Logic Modules
Number of Logic Cells 86316
Flash Size 512KB
Height Seated (Max) 2.44mm
Length 27mm
Width 27mm
RoHS Status RoHS Compliant

This SoC is built on ARM? Cortex?-M3 core processor(s).


ARM? Cortex?-M3 core processor(s) are used in the construction of this SoC.This system on a chip is packaged as 676-BGA by the manufacturer.As this SoC chip has 64KB RAM implemented, it provides reliable performance to its users.As far as its internal architecture is concerned, this SoC design employs the MCU, FPGA technique.SmartFusion?2 is the series number of this system on chip SoC.As a rule of thumb, the average operating temperature for this SoC meaning should be -40°C~100°C TJ.A significant feature of this SoC security is the combination of FPGA - 90K Logic Modules.Tray package houses this SoC system on a chip.425 I/Os are available in this SoC part.A power supply with a 1.2V voltage rating should be utilized when using this system on chip SoC.It is unsafe to operate the SoCs wireless at voltages above 1.26V.There is a possibility that it can be powered by a power supply of at least 1.14V.In order to cater to different design requirements, FIELD PROGRAMMABLE GATE ARRAY can be reconfigured to serve different needs.system on a chip benefits from 676 terminations.There is no doubt that this system on a chip is outstanding, just as other high-quality Field Programmable Gate Arrays will do.In order for this SoC chip to work properly, you can have 425 outputs.You will need to provide 1.2V power supplies in order to run system on chip.A SoC chip with 425 inputs is available.86316 logic cells are included in logic system on chips.This flash has a size of 512KB.A search for M2S090T will result in system on chips that have similar specs and purposes.wireless SoCs operate at 166MHz.In terms of core architecture, the SoC meaning relies on ARM.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
Core Architecture: ARM

There are a lot of Microsemi Corporation


M2S090T-1FGG676I System On Chip (SoC) applications.

  • Measurement tools
  • Body control module
  • Transmitters
  • Robotics
  • POS Terminals
  • Efficient hardware for training of neural networks
  • Digital Media
  • Smart appliances
  • Cyber security for critical applications in the aerospace
  • Robotics
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