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M2S060TS-1FGG676

676 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 387 I/O1.2V


  • Manufacturer: Microsemi Corporation
  • Origchip NO: 523-M2S060TS-1FGG676
  • Package: 676-BGA
  • Datasheet: PDF
  • Stock: 589
  • Description: 676 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 387 I/O1.2V (Kg)

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Details

Tags

Parameters
Factory Lead Time 10 Weeks
Lifecycle Status IN PRODUCTION (Last Updated: 3 weeks ago)
Package / Case 676-BGA
Surface Mount YES
Operating Temperature 0°C~85°C TJ
Packaging Tray
Published 2015
Series SmartFusion®2
JESD-609 Code e3
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 676
Terminal Finish MATTE TIN
HTS Code 8542.39.00.01
Subcategory Field Programmable Gate Arrays
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1.2V
Terminal Pitch 1mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B676
Number of Outputs 387
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.26V
Power Supplies 1.2V
Supply Voltage-Min (Vsup) 1.14V
Number of I/O 387
Speed 166MHz
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DDR, PCIe, SERDES
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture MCU, FPGA
Number of Inputs 387
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Primary Attributes FPGA - 60K Logic Modules
Number of Logic Cells 56520
Flash Size 256KB
Height Seated (Max) 2.44mm
Length 27mm
Width 27mm
RoHS Status RoHS Compliant

This SoC is built on ARM? Cortex?-M3 core processor(s).


There are ARM? Cortex?-M3 core processors in this SoC.Manufacturer assigns package 676-BGA to this system on a chip.As this SoC chip has 64KB RAM implemented, it provides reliable performance to its users.The internal architecture of this SoC design is based on the MCU, FPGA technique.SmartFusion?2 is the series name of this system on chip SoC.It is recommended that this SoC meaning be operated at 0°C~85°C TJ on an average.There is one thing to note about this SoC security: it combines FPGA - 60K Logic Modules.In the state-of-the-art Tray package, this SoC system on a chip is housed.This SoC part has a total of 387 I/Os.A power supply with a 1.2V rating is recommended.It is considered hazardous to operate the SoCs wireless with a voltage higher than 1.26V.It can feed on a power supply of at least 1.14V.The configuration of FIELD PROGRAMMABLE GATE ARRAY can be adapted to meet the needs of different design projects.There are 676 terminations in total and that really benefits system on a chip.In addition, it boasts impressive system on a chipming capabilities, just like other high-quality Field Programmable Gate Arrays.This SoC chip is capable of having 387 outputs, which is convenient.As far as power supplies are concerned, system on chip requires 1.2V.387 inputs are available on the SoC chip.System on chips of logic are comprised of 56520 logic cells.The flash size of the SoC meaning is 256KB.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
256KB extended flash.

There are a lot of Microsemi Corporation


M2S060TS-1FGG676 System On Chip (SoC) applications.

  • AC drive control module
  • Measurement tools
  • Three phase UPS
  • External USB hard disk/SSD
  • Communication interfaces ( I2C, SPI )
  • Servo drive control module
  • Microcontroller based SoC ( RISC-V, ARM)
  • Special Issue Information
  • Smartphones
  • sequence controllers
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