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M2S060-FG676

676 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 387 I/O1.2V


  • Manufacturer: Microsemi Corporation
  • Origchip NO: 523-M2S060-FG676
  • Package: 676-BGA
  • Datasheet: PDF
  • Stock: 860
  • Description: 676 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 387 I/O1.2V (Kg)

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Details

Tags

Parameters
Factory Lead Time 11 Weeks
Lifecycle Status IN PRODUCTION (Last Updated: 2 weeks ago)
Package / Case 676-BGA
Surface Mount YES
Operating Temperature 0°C~85°C TJ
Packaging Tray
Published 2015
Series SmartFusion®2
JESD-609 Code e0
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 676
Terminal Finish Tin/Lead (Sn/Pb)
HTS Code 8542.39.00.01
Subcategory Field Programmable Gate Arrays
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1.2V
Terminal Pitch 1mm
Reach Compliance Code not_compliant
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B676
Number of Outputs 387
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.26V
Power Supplies 1.2V
Supply Voltage-Min (Vsup) 1.14V
Number of I/O 387
Speed 166MHz
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DDR, PCIe, SERDES
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture MCU, FPGA
Number of Inputs 387
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Primary Attributes FPGA - 60K Logic Modules
Number of Logic Cells 56520
Flash Size 256KB
Height Seated (Max) 2.44mm
Length 27mm
Width 27mm
RoHS Status Non-RoHS Compliant

This SoC is built on ARM? Cortex?-M3 core processor(s).


Based on the core processor(s) ARM? Cortex?-M3, this SoC has been developed.It has been assigned a package 676-BGA by its manufacturer for this system on a chip.Users will enjoy reliable performance with this SoC chip, which has implemented 64KB RAM.The internal architecture of this SoC design utilizes the MCU, FPGA technique.SmartFusion?2 is the series name of this system on chip SoC.Typical operating temperatures for this SoC meaning should be 0°C~85°C TJ.One important thing to mark down is that this SoC meaning combines FPGA - 60K Logic Modules.This SoC system on a chip has been designed in a state-of-the-art Tray package.In total, this SoC part has 387 I/Os.It is advised to utilize a 1.2V power supply.It is unsafe to operate the SoCs wireless at voltages above 1.26V.As a minimum, the power supply of the SoC system on a chip needs to be 1.14V.It is possible to configure FIELD PROGRAMMABLE GATE ARRAY to meet specific needs during the design process.The system on a chip uses 676 terminations in total.Likewise, it has a remarkable system on a chip capability, just like other high-quality Field Programmable Gate Arrays.You can have 387 user outputs for this SoC chip.In order to use system on chip, you will need a power supply of 1.2V.A SoC chip with 387 inputs is available.In logic system on chips, there are 56520 logic cells.The flash size of the SoC meaning is 256KB.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
256KB extended flash.

There are a lot of Microsemi Corporation


M2S060-FG676 System On Chip (SoC) applications.

  • ARM
  • Sensor network-on-chip (sNoC)
  • Automotive
  • System-on-chip (SoC)
  • Smart appliances
  • Mouse
  • Special Issue Editors
  • Efficient hardware for inference of neural networks
  • Central alarm system
  • Automated sorting equipment
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