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M2S005S-1VF400

0°C~85°C TJ System On ChipSmartFusion?2 Series 169 I/O

Manufacturer: Microsemi Corporation
Origchip NO: 523-M2S005S-1VF400
Package: 400-LFBGA
Datasheet: PDF
Stock: 640
Description: 0°C~85°C TJ System On ChipSmartFusion?2 Series 169 I/O(Kg)

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Shipping Cost

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FedEx International, 5-7 business days.

The following are some common countries' logistic time.
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Details

Tags

Parameters
Factory Lead Time	12 Weeks
Lifecycle Status	IN PRODUCTION (Last Updated: 1 month ago)
Package / Case	400-LFBGA
Supplier Device Package	400-VFBGA (17x17)
Operating Temperature	0°C~85°C TJ
Packaging	Tray
Published	2015
Series	SmartFusion®2
Part Status	Active
Moisture Sensitivity Level (MSL)	3 (168 Hours)
Number of I/O	169
Speed	166MHz
RAM Size	64KB
Core Processor	ARM® Cortex®-M3
Peripherals	DDR
Connectivity	CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture	MCU, FPGA
Primary Attributes	FPGA - 5K Logic Modules
Flash Size	128KB
RoHS Status	Non-RoHS Compliant

This SoC is built on ARM? Cortex?-M3 core processor(s).

ARM? Cortex?-M3 core processor(s) are used in the construction of this SoC.It has been assigned a package 400-LFBGA by its manufacturer for this system on a chip.Users will enjoy reliable performance with this SoC chip, which has implemented 64KB RAM.The internal architecture of this SoC design utilizes the MCU, FPGA technique.In the SmartFusion?2 series, this system on chip SoC is included.The average operating temps for this SoC meaning should be 0°C~85°C TJ.One important thing to mark down is that this SoC meaning combines FPGA - 5K Logic Modules.There is a state-of-the-art Tray package that houses this SoC system on a chip.169 I/Os are included in this SoC part.It has a 128KB flash.