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LFXP6C-3FN256C

1.8V V 2.1mm mm 11.9kB B FPGAs XP Series 320MHz MHz 256-BGA 1mm mm 256

Manufacturer: Lattice Semiconductor Corporation
Origchip NO: 477-LFXP6C-3FN256C
Package: 256-BGA
Datasheet: PDF
Stock: 849
Description: 1.8V V 2.1mm mm 11.9kB B FPGAs XP Series 320MHz MHz 256-BGA 1mm mm 256 (Kg)

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Details

Tags

Parameters
Operating Supply Voltage	1.8V
Power Supplies	1.8/2.5/3.3V
Memory Size	11.9kB
Number of I/O	188
RAM Size	9kB
Organization	720 CLBS
Programmable Logic Type	FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells	6000
Total RAM Bits	73728
Combinatorial Delay of a CLB-Max	0.63 ns
Number of CLBs	720
Number of Logic Cells	720
Height Seated (Max)	2.1mm
Length	17mm
Width	17mm
Radiation Hardening	No
RoHS Status	RoHS Compliant
Lead Free	Lead Free
Mount	Surface Mount
Mounting Type	Surface Mount
Package / Case	256-BGA
Number of Pins	256
Operating Temperature	0°C~85°C TJ
Packaging	Tray
Published	2007
Series	XP
JESD-609 Code	e1
Pbfree Code	yes
Part Status	Obsolete
Moisture Sensitivity Level (MSL)	3 (168 Hours)
Number of Terminations	256
ECCN Code	EAR99
Terminal Finish	Tin/Silver/Copper (Sn/Ag/Cu)
HTS Code	8542.39.00.01
Subcategory	Field Programmable Gate Arrays
Technology	CMOS
Voltage - Supply	1.71V~3.465V
Terminal Position	BOTTOM
Terminal Form	BALL
Peak Reflow Temperature (Cel)	250
Supply Voltage	1.8V
Terminal Pitch	1mm
Frequency	320MHz
Time@Peak Reflow Temperature-Max (s)	40
Base Part Number	LFXP6
Pin Count	256
Number of Outputs	188

LFXP6C-3FN256C Overview

In the 256-BGA package, you will find fpga chips. FPGAs of this type consist of FIELD PROGRAMMABLE GATE ARRAY components. There are 188 I/Os for better data transfer. There are 6000 logic elements/cells to form a fundamental building block. Fpga chips is powered from a supply voltage of 1.8V. In this case, the FPGA part belongs to the Field Programmable Gate Arrays family. FPGA modules can be attached to development boards using a Surface Mount-connector. With a supply voltage of 1.71V~3.465V, this device operates with ease. There are many types of FPGAs in the XP series, this is one of them. The operating temperature should be kept at 0°C~85°C TJ when operating. In order to make this device as versatile as possible, there are 188 different outputs included. Fpga chips is designed to maximiTraye space efficiency by containing the FPGA model in Tray. In total, it has 256 terminations on each end. The RAM bits that are offered by this fpga chips are 73728. In order to find related parts, use the part number LFXP6 as a base. During the configuration of this FPGA module, the RAM si9kBe reaches 9kB to ensure that the program runs normally. The device is designed with 256 pins in total. I think, as long as this FPGA is mounted in Surface Mount, it could perform excellently according to its specifications as long as you mount it in Surface Mount. Designers can fully utilize its flexibility with 1.8V supply voltage. Power is supplied to the device by a 1.8/2.5/3.3V battery. This device has a pin count of 256 in fpga semiconductor. Data and programs can be stored in this FPGA module's memory of 11.9kB. For its architecture, 720 CLB modules are used. The system operates at a frequency of 320MHz in order to achieve maximum efficiency. For the building block of this system, 720 logic cells are included.