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KSZ9031MNXIC

64 TerminationsKSZ9031 Receivers4/4 Drivers/Receivers1 Functions

Manufacturer: Microchip Technology
Origchip NO: 536-KSZ9031MNXIC
Package: 64-VFQFN Exposed Pad
Datasheet: PDF
Stock: 831
Description: 64 TerminationsKSZ9031 Receivers4/4 Drivers/Receivers1 Functions(Kg)

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FedEx International, 5-7 business days.

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Details

Tags

Parameters
Factory Lead Time	18 Weeks
Mount	Surface Mount
Mounting Type	Surface Mount
Package / Case	64-VFQFN Exposed Pad
Operating Temperature	-40°C~85°C
Packaging	Tray
JESD-609 Code	e3
Part Status	Active
Moisture Sensitivity Level (MSL)	3 (168 Hours)
Number of Terminations	64
Type	Transceiver
Terminal Finish	Matte Tin (Sn) - annealed
HTS Code	8542.39.00.01
Voltage - Supply	1.8V 2.5V 3.3V
Terminal Position	QUAD
Terminal Form	NO LEAD
Peak Reflow Temperature (Cel)	260
Number of Functions	1
Supply Voltage	1.2V
Terminal Pitch	0.4mm
Time@Peak Reflow Temperature-Max (s)	30
Base Part Number	KSZ9031
JESD-30 Code	S-XQCC-N64
Data Rate	1Gbps
Protocol	Ethernet
Number of Drivers/Receivers	4/4
Duplex	Full
Simplex/Duplex	Full Duplex
Height Seated (Max)	0.9mm
Length	8mm
Width	8mm
RoHS Status	ROHS3 Compliant

KSZ9031MNXIC Overview

Driver ICs with enhanced 64-VFQFN Exposed Pad packages are excellent for driving LEDs with common characteristics.Tray package is used for this receiver.As a Transceiver can transceiver, this part has enabled many applications to be served.Ideally, you should place this wide receiver on a Surface Mount-type PCB or development board.This differential driver requires a 1.8V 2.5V 3.3V power supply.There can be up to 4/4 eligible receivers/drivers on the field at the same time with this electronic part.IC receiver is designed for applications with a temperature of -40°C~85°C.Wide receiver can operate within the range of 1.2V supply voltages efficiently.There are 64 terminations in this wide receiver so that signals can be driven from the data and received.Since the base part number KSZ9031 describes the product type, temperature, package, etc., you might get more options by searching with it.Through optical transceiver downsizing and high-density Surface Mount mounting technologies, its package size is reduced dramatically.