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KSZ9031MNXCC

64 TerminationsKSZ9031 Receivers4/4 Drivers/Receivers1 Functions

Manufacturer: Microchip Technology
Origchip NO: 536-KSZ9031MNXCC
Package: 64-VFQFN Exposed Pad
Datasheet: PDF
Stock: 866
Description: 64 TerminationsKSZ9031 Receivers4/4 Drivers/Receivers1 Functions(Kg)

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Details

Tags

Parameters
Factory Lead Time	9 Weeks
Mount	Surface Mount
Mounting Type	Surface Mount
Package / Case	64-VFQFN Exposed Pad
Operating Temperature	0°C~70°C
Packaging	Tray
Published	2015
JESD-609 Code	e3
Part Status	Active
Moisture Sensitivity Level (MSL)	3 (168 Hours)
Number of Terminations	64
Type	Transceiver
Terminal Finish	Matte Tin (Sn) - annealed
HTS Code	8542.39.00.01
Voltage - Supply	1.8V 2.5V 3.3V
Terminal Position	QUAD
Terminal Form	NO LEAD
Peak Reflow Temperature (Cel)	260
Number of Functions	1
Supply Voltage	1.2V
Terminal Pitch	0.4mm
Time@Peak Reflow Temperature-Max (s)	30
Base Part Number	KSZ9031
JESD-30 Code	S-XQCC-N64
Data Rate	1 Gbps
Protocol	Ethernet
Number of Drivers/Receivers	4/4
Duplex	Full
Simplex/Duplex	Full Duplex
Height Seated (Max)	0.9mm
Length	8mm
Width	8mm
RoHS Status	ROHS3 Compliant

KSZ9031MNXCC Overview

An excellent driver IC for common LEDs thanks to its enhanced 64-VFQFN Exposed Pad package.In the Tray package, this receiver is mounted.As a Transceiver can transceiver, this part has enabled many applications to be served.PCBs or development boards with Surface Mount-types can accommodate this wide receiver.With respect to the power supply, this differential driver uses 1.8V 2.5V 3.3V.There can be up to 4/4 eligible receivers/drivers on the field at the same time with this electronic part.Applications with operating temperatures of 0°C~70°C have been designed primarily for this ic receiver.An output voltage range of 1.2V is sufficient to run this line driver ic efficiently.The integrated terminations of this wide receiver allow it to drive and receive signals from data.For more variants of this part, try searching with the base part number KSZ9031, which indicates the product type, temperature, package, etc.A combination of optical transceiver downsizing and high-density Surface Mount mounting reduces the package size dramatically.