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KSZ8061RNBW

32 Terminations32 Pin KSZ8061 Receivers1/1 Drivers/Receivers1 Functions

Manufacturer: Microchip Technology
Origchip NO: 536-KSZ8061RNBW
Package: 32-VFQFN Exposed Pad
Datasheet: PDF
Stock: 626
Description: 32 Terminations32 Pin KSZ8061 Receivers1/1 Drivers/Receivers1 Functions(Kg)

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Details

Tags

Parameters
Factory Lead Time	15 Weeks
Mount	Surface Mount
Mounting Type	Surface Mount
Package / Case	32-VFQFN Exposed Pad
Number of Pins	32
Operating Temperature	-40°C~105°C
Packaging	Tray
Published	2015
Part Status	Active
Moisture Sensitivity Level (MSL)	3 (168 Hours)
Number of Terminations	32
Type	Transceiver
HTS Code	8542.39.00.01
Voltage - Supply	1.8V 2.5V 3.3V
Terminal Position	QUAD
Terminal Form	NO LEAD
Number of Functions	1
Supply Voltage	1.2V
Terminal Pitch	0.5mm
Base Part Number	KSZ8061
Data Rate	100Mbps
Protocol	Ethernet
Number of Drivers/Receivers	1/1
Duplex	Full
Simplex/Duplex	Full Duplex
Height Seated (Max)	1mm
Length	5mm
Width	5mm
REACH SVHC	No SVHC
RoHS Status	ROHS3 Compliant

KSZ8061RNBW Overview

Designed for common LEDs, this driver IC features an enhanced 32-VFQFN Exposed Pad package.There is a Tray package for this receiver.The Transceiver can transceiver type enables this part to be used in a wide range of applications.On any Surface Mount-type PCB or development board, you can install this wide receiver.This differential driver uses 1.8V 2.5V 3.3V for power supply.At any given time, there can be up to 1/1 eligible receivers/drivers for this electronic part.Applications with operating temperatures of -40°C~105°C have been designed primarily for this ic receiver.Wide receiver can operate within the range of 1.2V supply voltages efficiently.This integrated circuit has 32 terminations designed for driving and receiving signals from data.This part number KSZ8061 can be used to search for more variants based on the product type, temperature, package, etc.An enhanced power dissipation driver IC with 32 pins.The package size of this optical transceiver has been dramatically reduced by downsizing ICs and using high-density Surface Mount mounting techniques.