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KSZ8061MNGW

48 TerminationsKSZ8061 Receivers1/1 Drivers/Receivers1 Functions

Manufacturer: Microchip Technology
Origchip NO: 536-KSZ8061MNGW
Package: 48-VFQFN Exposed Pad
Datasheet: PDF
Stock: 321
Description: 48 TerminationsKSZ8061 Receivers1/1 Drivers/Receivers1 Functions(Kg)

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Shipping Cost

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FedEx International, 5-7 business days.

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Details

Tags

Parameters
Factory Lead Time	15 Weeks
Mount	Surface Mount
Mounting Type	Surface Mount
Package / Case	48-VFQFN Exposed Pad
Operating Temperature	-40°C~105°C
Packaging	Tray
Published	2015
Part Status	Active
Moisture Sensitivity Level (MSL)	3 (168 Hours)
Number of Terminations	48
Type	Transceiver
HTS Code	8542.39.00.01
Voltage - Supply	1.8V 2.5V 3.3V
Terminal Position	QUAD
Terminal Form	NO LEAD
Peak Reflow Temperature (Cel)	NOT SPECIFIED
Number of Functions	1
Supply Voltage	1.2V
Terminal Pitch	0.5mm
Time@Peak Reflow Temperature-Max (s)	NOT SPECIFIED
Base Part Number	KSZ8061
JESD-30 Code	S-XQCC-N48
Data Rate	100Mbps
Protocol	Ethernet
Number of Drivers/Receivers	1/1
Duplex	Full
Simplex/Duplex	Full Duplex
Height Seated (Max)	0.9mm
Length	7mm
Width	7mm
RoHS Status	ROHS3 Compliant

KSZ8061MNGW Overview

LED drivers benefit from this IC's enhanced 48-VFQFN Exposed Pad package.The package of this receiver is Tray.Since this is a Transceiver can transceiver, many solutions can use it for a variety of functions.Any Surface Mount-type PCB or development board can be used with this wide receiver.In terms of power supply, this differential driver utilizes 1.8V 2.5V 3.3V.This electronic part can have?up to 1/1 eligible receivers/drivers on the field at once.?As its name implies, this ic receiver is designed for applications where -40°C~105°C is the operating temperature.There is a voltage range of 1.2V for this line driver ic, so it can operate efficiently.For driving and receiving signals from data, this wide receiver has 48 terminations integrated.For more variants of this part, try searching with the base part number KSZ8061, which indicates the product type, temperature, package, etc.Package size is drastically reduced by downsizing ICs and mounting them in high-density Surface Mount arrays.