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IGD616IC1

Through Hole Tray Last Time Buy Gate Drivers ICs Inverting 1 36-DIP Module, 24 Leads High-Side or Low-Side

Manufacturer: Power Integrations
Origchip NO: 633-IGD616IC1
Package: 36-DIP Module, 24 Leads
Datasheet: PDF
Stock: 410
Description: Through Hole Tray Last Time Buy Gate Drivers ICs Inverting 1 36-DIP Module, 24 Leads High-Side or Low-Side (Kg)

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Details

Tags

Parameters
Mounting Type	Through Hole
Package / Case	36-DIP Module, 24 Leads
Operating Temperature	-40°C~85°C TA
Packaging	Tray
Series	SCALE™-1
Part Status	Last Time Buy
Voltage - Supply	14V~16V
Input Type	Inverting
Rise / Fall Time (Typ)	100ns 80ns
Interface IC Type	BUFFER OR INVERTER BASED IGBT DRIVER
Channel Type	Single
Number of Drivers	1
Driven Configuration	High-Side or Low-Side
Gate Type	IGBT, N-Channel, P-Channel MOSFET
RoHS Status	RoHS Compliant

IGD616IC1 Overview

A higher degree of flexibility is achieved by adopting its 36-DIP Module, 24 Leads package.A packaging method of Tray is used.The configuration is supported by 1 drivers.Through Hole is mounted in the way.When the supply voltage is 14V~16V it is able to demonstrate its superiority.IGBT, N-Channel, P-Channel MOSFET is the gate type used for this design.This device can operate at temperatures up to -40°C~85°C TA.The input type for this program is Inverting.The interface IC of the device is BUFFER OR INVERTER BASED IGBT DRIVER.Gate drivers in this series are included in the SCALE?-1 series.