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HTSW-130-17-L-D

SAMTEC HTSW-130-17-L-D Board-To-Board Connector, Vertical, HTSW Series, 60 Contacts, Header, 2.54 mm, Through Hole, 2 Rows

Manufacturer: Samtec Inc.
Origchip NO: 680-HTSW-130-17-L-D
Package: -
Datasheet: PDF
Stock: 985
Description: SAMTEC HTSW-130-17-L-D Board-To-Board Connector, Vertical, HTSW Series, 60 Contacts, Header, 2.54 mm, Through Hole, 2 Rows (Kg)

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Shipping Cost

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Delivery Time

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FedEx International, 5-7 business days.

The following are some common countries' logistic time.
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Details

Tags

Parameters
Factory Lead Time	3 Weeks
Contact Material	Phosphor Bronze
Mount	Through Hole
Mounting Type	Through Hole
Contact Shape	Square
Insulation Material	Liquid Crystal Polymer (LCP)
Operating Temperature	-55°C~125°C
Packaging	Bulk
Published	2005
Series	HTSW
JESD-609 Code	e3
Pbfree Code	yes
Part Status	Active
Moisture Sensitivity Level (MSL)	Not Applicable
Termination	Solder
Connector Type	Header
Number of Positions	60
Number of Rows	2
Gender	Male
Additional Feature	E.L.P.
Fastening Type	Push-Pull
Contact Finish - Mating	Gold
MIL Conformance	NO
DIN Conformance	NO
IEC Conformance	NO
Filter Feature	NO
Contact Type	Male Pin
Mixed Contacts	NO
Option	GENERAL PURPOSE
Current Rating (Amps)	Varies by WireGAuge
Insulation Height	0.100 2.54mm
Style	Board to Board or Cable
Number of Positions Loaded	All
Pitch - Mating	0.100 2.54mm
Insulation Color	Natural
Number of Conductors	ONE
Reliability	COMMERCIAL
Body Length or Diameter	3 inch
Row Spacing - Mating	0.100 (2.54mm)
Contact Length - Post	0.110 2.79mm
Shrouding	Unshrouded
Number Of PCB Rows	2
Lead Pitch	2.54mm
Contact Finish - Post	Tin
Contact Length - Mating	0.620 15.75mm
PCB Contact Pattern	RECTANGULAR
Body Breadth	0.198 inch
Body Depth	0.1 inch
Overall Contact Length	0.830 21.08mm
Mating Contact Pitch	0.1 inch
Contact Finish Thickness - Mating	10.0μin 0.25μm
Material Flammability Rating	UL94 V-0
REACH SVHC	No SVHC
RoHS Status	ROHS3 Compliant