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HSP50216KIZ

HSP50216KIZ datasheet pdf and RF Misc ICs and Modules product details from Renesas Electronics America Inc. stock available at Feilidi

Manufacturer: Renesas Electronics America Inc.
Origchip NO: 668-HSP50216KIZ
Package: 196-LFBGA
Datasheet: PDF
Stock: 144
Description: HSP50216KIZ datasheet pdf and RF Misc ICs and Modules product details from Renesas Electronics America Inc. stock available at Feilidi (Kg)

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Details

Tags

Parameters
Package / Case	196-LFBGA
Surface Mount	YES
Packaging	Tray
JESD-609 Code	e3
Part Status	Active
Moisture Sensitivity Level (MSL)	3 (168 Hours)
Number of Terminations	196
Terminal Finish	Matte Tin (Sn)
HTS Code	8542.39.00.01
Terminal Position	BOTTOM
Terminal Form	BALL
Peak Reflow Temperature (Cel)	260
Supply Voltage	3.3V
Terminal Pitch	0.8mm
Time@Peak Reflow Temperature-Max (s)	40
JESD-30 Code	S-PBGA-B196
Function	Downconverter
Qualification Status	Not Qualified
Operating Temperature (Max)	85°C
Operating Temperature (Min)	-40°C
Temperature Grade	INDUSTRIAL
Telecom IC Type	BASEBAND CIRCUIT
RF Type	W-CDMA
Height Seated (Max)	1.5mm
Length	12mm
Width	12mm
RoHS Status	ROHS3 Compliant
Factory Lead Time	13 Weeks
Mounting Type	Surface Mount