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HSM08DRAN

HSM08DRAN datasheet pdf and Card Edge Connectors - Edgeboard Connectors product details from Sullins Connector Solutions stock available at XINJIADA

Manufacturer: Sullins Connector Solutions
Origchip NO: 765-HSM08DRAN
Package: -
Datasheet: PDF
Stock: 944
Description: HSM08DRAN datasheet pdf and Card Edge Connectors - Edgeboard Connectors product details from Sullins Connector Solutions stock available at XINJIADA(Kg)

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FedEx International, 5-7 business days.

The following are some common countries' logistic time.
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Details

Tags

Parameters
Factory Lead Time	3 Weeks
Contact Material	Beryllium Copper
Mount	Through Hole
Mounting Type	Through Hole, Right Angle
Material - Insulation	Polybutylene Terephthalate (PBT)
Operating Temperature	-65°C~125°C
Packaging	Tray
Published	2015
JESD-609 Code	e4
Pbfree Code	yes
Part Status	Active
Moisture Sensitivity Level (MSL)	Not Applicable
Termination	Solder
ECCN Code	EAR99
Connector Type	Full Bellows
Number of Positions	16
Color	Blue
Number of Rows	2
Gender	Female
Subcategory	Headers and Edge Type Connectors
Contact Type	Full Bellows
Pitch	0.156 3.96mm
Total Number of Contacts	16
Number of Conductors	ONE
Reference Standard	UL, CSA
Contact Finish	Gold
Reliability	COMMERCIAL
Number Of PCB Rows	2
PCB Contact Pattern	RECTANGULAR
Body Depth	0.431 inch
Rated Current (Signal)	3A
Contact Resistance	30mOhm
Card Type	Non Specified - Dual Edge
Read Out	Dual
Insulation Resistance	5000000000Ohm
Number of Positions/Bay/Row	8
Body/Shell Style	RECEPTACLE
Withdrawl Force-Min	.139 N
Mating Contact Row Spacing	0.156 inch
Contact Finish Thickness	10.0μin 0.25μm
Plating Thickness	10μin
Card Thickness	0.062 1.57mm
RoHS Status	ROHS3 Compliant
Lead Free	Lead Free

HSM08DRAN Overview

Packaging was done to Tray's specifications.You should mount it type Through Hole, Right Angle.The device is connected with the connector socket Full Bellows.