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FGB3056-F085

FGB3056-F085 datasheet pdf and PMIC - Full, Half-Bridge Drivers product details from ON Semiconductor stock available at XINJIADA

Manufacturer: ON Semiconductor
Origchip NO: 598-FGB3056-F085
Package: TO-263-3, D2Pak (2 Leads + Tab), TO-263AB
Datasheet: PDF
Stock: 639
Description: FGB3056-F085 datasheet pdf and PMIC - Full, Half-Bridge Drivers product details from ON Semiconductor stock available at XINJIADA(Kg)

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Details

Tags

Parameters
Factory Lead Time	16 Weeks
Lifecycle Status	ACTIVE (Last Updated: 6 days ago)
Mount	Surface Mount
Mounting Type	Surface Mount
Package / Case	TO-263-3, D2Pak (2 Leads + Tab), TO-263AB
Weight	1.31247g
Operating Temperature	-40°C~175°C TJ
Packaging	Tape & Reel (TR)
Published	2013
JESD-609 Code	e3
Pbfree Code	yes
Part Status	Active
Moisture Sensitivity Level (MSL)	1 (Unlimited)
Terminal Finish	Tin (Sn)
Applications	General Purpose
Technology	IGBT
Peak Reflow Temperature (Cel)	NOT SPECIFIED
Reach Compliance Code	not_compliant
Time@Peak Reflow Temperature-Max (s)	NOT SPECIFIED
Interface	Logic
Output Configuration	Half Bridge
Current - Output / Channel	29A
Load Type	Inductive, Capacitive
RoHS Status	ROHS3 Compliant

FGB3056-F085 Overview

Tape & Reel (TR) is used to package H bridge.H bridge is included in the TO-263-3, D2Pak (2 Leads + Tab), TO-263AB package as a cost-saving measure.H bridge circuit is mounted in the way of Surface Mount.Motor driver H bridge's operating temperature enables -40°C~175°C TJ to function normally.H bridge motor driver can be used for a variety of purposes, including General Purpose.PCB mounting is performed using Surface Mount.