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EPM7256SRC208-7ES

PMIC MAX? 7000S Series 208-BFQFP Exposed Pad

Manufacturer: Intel
Origchip NO: 386-EPM7256SRC208-7ES
Package: 208-BFQFP Exposed Pad
Datasheet: PDF
Stock: 154
Description: PMIC MAX? 7000S Series 208-BFQFP Exposed Pad (Kg)

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Shipping Cost

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The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

Shipping Method

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Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.
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Details

Tags

Parameters
Mounting Type	Surface Mount
Package / Case	208-BFQFP Exposed Pad
Supplier Device Package	208-RQFP (28x28)
Operating Temperature	0°C~70°C TA
Packaging	Tray
Series	MAX® 7000S
Part Status	Obsolete
Moisture Sensitivity Level (MSL)	3 (168 Hours)
Programmable Type	In System Programmable
Number of I/O	164
Number of Gates	5000
Number of Macro Cells	256
Voltage Supply - Internal	4.75V~5.25V
Delay Time tpd(1) Max	7.5ns
Number of Logic Elements/Blocks	16

EPM7256SRC208-7ES Overview

In the mobile phone network, there are 256macro cells, which are cells with high-power antennas and towers.It is embedded in the 208-BFQFP Exposed Pad package.There are 164 I/Os programmed in it.It is packaged in the way of Tray.To ensure reliability, the device operates at a temperature of [0].Ensure that the chip is mounted by Surface Mount.The MAX? 7000Sseries comprises this type of FPGA.There are 5000 gates, which are devices that acts as a building block for digital circuits. This logic block consists of 16logic elements.