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DS3152N

144 TerminationsTelecom device2 Circuits


  • Manufacturer: Rochester Electronics, LLC
  • Origchip NO: 699-DS3152N
  • Package: 144-BGA, CSPBGA
  • Datasheet: PDF
  • Stock: 704
  • Description: 144 TerminationsTelecom device2 Circuits(Kg)

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Details

Tags

Parameters
Mounting Type Surface Mount
Package / Case 144-BGA, CSPBGA
Surface Mount YES
Operating Temperature -40°C~85°C
Packaging Tray
Pbfree Code no
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 144
Terminal Finish NOT SPECIFIED
Voltage - Supply 3.135V~3.465V
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 240
Supply Voltage 3.3V
Terminal Pitch 1mm
Time@Peak Reflow Temperature-Max (s) 20
JESD-30 Code S-PBGA-B144
Function Line Interface Unit (LIU)
Qualification Status COMMERCIAL
Interface LIU
Number of Circuits 2
Current - Supply 150mA
Telecom IC Type PCM TRANSCEIVER
Height Seated (Max) 1.76mm
Length 13mm
Width 13mm
RoHS Status Non-RoHS Compliant

DS3152N Overview


A 144-BGA, CSPBGA package is used to reduce board space requirements.Telecommunications equipment is packed according to Tray's method.The mounting type of this telecom circuit is Surface Mount.Telecom circuit is made up of 2 circuits.When the voltage for 3.135V~3.465V is provided, improved efficiency can be achieved.Using -40°C~85°C as the operating temperature can result in reliable performance.Telecom switching configuration has 144 terminations.It operates at a voltage of 3.3V.It adopts PCM TRANSCEIVER as its telecom IC type.A current of 150mA is used as the supply current.

DS3152N Features


Available in the 144-BGA, CSPBGA package
PCM TRANSCEIVER as telecom IC type

DS3152N Applications


There are a lot of Rochester Electronics, LLC DS3152N Telecom applications.

  • PBXs channel bank
  • High speed data transmission line cards
  • Interfaces to SONET STS-1 Networks
  • Channel Banks
  • Inverse Multiplexing for ATM (IMA)
  • PBX (Private Branch Exchange)
  • Stations
  • DECT (Digital European Cordless Telephone) Base
  • High-Density T1/E1/J1 interfaces for Multiplexers
  • T1/E1/J1 Multiplexer and Channel Banks
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