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DS3112D1

256 TerminationsDS3112 Telecom device1 Functions

Manufacturer: Maxim Integrated
Origchip NO: 503-DS3112D1
Package: 256-BGA
Datasheet: PDF
Stock: 331
Description: 256 TerminationsDS3112 Telecom device1 Functions(Kg)

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Details

Tags

Parameters
Mounting Type	Surface Mount
Package / Case	256-BGA
Surface Mount	YES
Operating Temperature	0°C~70°C
Packaging	Tray
Published	2006
Pbfree Code	no
Part Status	Obsolete
Moisture Sensitivity Level (MSL)	1 (Unlimited)
Number of Terminations	256
ECCN Code	EAR99
HTS Code	8542.39.00.01
Technology	CMOS
Voltage - Supply	3.135V~3.465V
Terminal Position	BOTTOM
Terminal Form	BALL
Peak Reflow Temperature (Cel)	240
Number of Functions	1
Supply Voltage	3.3V
Terminal Pitch	1.27mm
Time@Peak Reflow Temperature-Max (s)	20
Base Part Number	DS3112
Pin Count	256
JESD-30 Code	S-PBGA-B256
Qualification Status	Not Qualified
Interface	Parallel/Serial
Current - Supply	150mA
Telecom IC Type	FRAMER
Height Seated (Max)	2.34mm
Length	27mm
Width	27mm
RoHS Status	ROHS3 Compliant

DS3112D1 Overview

256-BGA package is used to save board space.To pack telecommunications equipment, the way of Tray is used.Surface Mount is used as telecommunications equipment mounting type.When 3.135V~3.465V is supplied wtelecom IC's efficiencyh power, efficiency can be improved.At 0°C~70°C, reliable performance can be achieved.The configuration includes 256 terminations.3.3V is its supply voltage.DS3112 is the base part number, which can be used to find more related parts.It uses a FRAMER type telecom IC.Telecom equipment operates wit h a supply current of 150mA.When designing, it is configured with 1 functions.Pins on 256 telecom products are designed to fit its configuration.