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DS1211SN+

DS1211SN+ datasheet pdf and Memory - Controllers product details from Maxim Integrated stock available at XINJIADA

Manufacturer: Maxim Integrated
Origchip NO: 503-DS1211SN+
Package: 20-SOIC (0.295, 7.50mm Width)
Datasheet: PDF
Stock: 108
Description: DS1211SN+ datasheet pdf and Memory - Controllers product details from Maxim Integrated stock available at XINJIADA(Kg)

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Details

Tags

Parameters
Mounting Type	Surface Mount
Package / Case	20-SOIC (0.295, 7.50mm Width)
Surface Mount	YES
Operating Temperature	-40°C~85°C
Packaging	Tube
Published	1999
JESD-609 Code	e3
Part Status	Obsolete
Moisture Sensitivity Level (MSL)	1 (Unlimited)
Number of Terminations	20
ECCN Code	EAR99
Terminal Finish	Matte Tin (Sn)
HTS Code	8542.31.00.01
Technology	CMOS
Voltage - Supply	4.75V~5.5V
Terminal Position	DUAL
Terminal Form	GULL WING
Peak Reflow Temperature (Cel)	260
Supply Voltage	5V
Terminal Pitch	1.27mm
Time@Peak Reflow Temperature-Max (s)	NOT SPECIFIED
Base Part Number	DS1211
Pin Count	20
JESD-30 Code	R-PDSO-G20
Qualification Status	Not Qualified
uPs/uCs/Peripheral ICs Type	MICROPROCESSOR CIRCUIT
Controller Type	Nonvolatile RAM
Height Seated (Max)	2.65mm
Length	12.8mm
Width	7.5mm
RoHS Status	ROHS3 Compliant
Lead Free	Lead Free

DS1211SN+ Overview

Materials from Tube are included in the packaging. The 20-SOIC (0.295, 7.50mm Width) is provided in order to conserve board space. There are several types of Nonvolatile RAM and it is a high-quality and reliable type. Setting the operating temperature to -40°C~85°C is recommended. It is necessary to supply voltage to 4.75V~5.5V in order to ensure normal operation. The mounting technique is based on the Surface Mount method. Using its base part number DS1211, more related electronic parts can be identified. Signals are prevented from reflecting off the transmission line end by means of 20 terminations. The device has a 5V supply voltage. The pin configuration is 20. The component with the lowest tolerance for high temperatures determines the reflow temperature limit of 260. The uPs/uCs/peripheral ICs of the device are integrated with a type of MICROPROCESSOR CIRCUIT.