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CYV15G0404DXB-BGXC

256 TerminationsTelecom device4 Circuits1 Functions

Manufacturer: Rochester Electronics, LLC
Origchip NO: 699-CYV15G0404DXB-BGXC
Package: 256-LBGA Exposed Pad
Datasheet: PDF
Stock: 749
Description: 256 TerminationsTelecom device4 Circuits1 Functions(Kg)

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Details

Tags

Parameters
Mounting Type	Surface Mount
Package / Case	256-LBGA Exposed Pad
Surface Mount	YES
Operating Temperature	0°C~70°C
Packaging	Tray
Series	HOTlink II™
Part Status	Obsolete
Moisture Sensitivity Level (MSL)	3 (168 Hours)
Number of Terminations	256
Terminal Finish	NOT SPECIFIED
Technology	BICMOS
Voltage - Supply	3.135V~3.465V
Terminal Position	BOTTOM
Terminal Form	BALL
Number of Functions	1
Supply Voltage	3.3V
Terminal Pitch	1.27mm
Reach Compliance Code	unknown
Pin Count	256
JESD-30 Code	S-PBGA-B256
Qualification Status	COMMERCIAL
Interface	LVTTL
Number of Circuits	4
Current - Supply	900mA
Telecom IC Type	TELECOM CIRCUIT
Length	27mm
Width	27mm
RoHS Status	ROHS3 Compliant

CYV15G0404DXB-BGXC Overview

A 256-LBGA Exposed Pad package saves space on a board.A Tray-packing method is used to pack telecommunications equipment.Telecommunications equipment is mounted with type Surface Mount.Telecommunications equipment consists of 4 circuits.When the voltage for 3.135V~3.465V is provided, improved efficiency can be achieved.A 0°C~70°C-temperature setting offers reliable performance.In telecom switching configuration, 256 terminations are present.It operates at voltage 3.3V.Telecom ICs are of type TELECOM CIRCUIT.Telecom equipment operates wit h a supply current of 900mA.With the HOTlink II? series electronic parts, it can perform similar functions of the telecommunication product .When designing, 1 functions are configured.A 256 telecom product's pins are designed for the configuration of that telecom product.