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CYP15G0402DXB-BGC

256 TerminationsTelecom device4 Circuits1 Functions

Manufacturer: Rochester Electronics, LLC
Origchip NO: 699-CYP15G0402DXB-BGC
Package: 256-LBGA Exposed Pad
Datasheet: PDF
Stock: 924
Description: 256 TerminationsTelecom device4 Circuits1 Functions(Kg)

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Details

Tags

Parameters
Peak Reflow Temperature (Cel)	220
Number of Functions	1
Supply Voltage	3.3V
Terminal Pitch	1.27mm
Reach Compliance Code	unknown
Time@Peak Reflow Temperature-Max (s)	NOT SPECIFIED
Pin Count	256
JESD-30 Code	S-PBGA-B256
Qualification Status	COMMERCIAL
Interface	LVTTL
Number of Circuits	4
Current - Supply	830mA
Telecom IC Type	TELECOM CIRCUIT
Length	27mm
Width	27mm
RoHS Status	Non-RoHS Compliant
Mounting Type	Surface Mount
Package / Case	256-LBGA Exposed Pad
Surface Mount	YES
Operating Temperature	0°C~70°C
Packaging	Tray
Series	HOTlink II™
JESD-609 Code	e0
Pbfree Code	no
Part Status	Obsolete
Moisture Sensitivity Level (MSL)	3 (168 Hours)
Number of Terminations	256
Terminal Finish	TIN LEAD
Technology	BICMOS
Voltage - Supply	3.135V~3.465V
Terminal Position	BOTTOM
Terminal Form	BALL

CYP15G0402DXB-BGC Overview

The 256-LBGA Exposed Pad package reduces the amount of space on a board.The way of Tray is employed for telecommunications equipment packing.The mounting type is Surface Mount.A 4-circuit composes this telecom IC .Providing 3.135V~3.465V wtelecom IC's efficiencyh the correct supply voltage will improve efficiency.Reliable performance can be offered when the operating temperature is set at 0°C~70°C.Telecom switching configuration has 256 terminations.A 3.3V supply voltage is required to operate it.TELECOM CIRCUIT is the type of IC it uses for telecom.Telecom equipment operates wit h a supply current of 830mA.It is able to provide a lots of similar functions of the telecommunication product with the electronic parts under the HOTlink II? series.Telecommunications device is configured wit h 1 functions when designing.There is a specific configuration for the pins on the 256 telecom product.