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CSD95492QVM

CSD95492QVM datasheet pdf and PMIC - Full, Half-Bridge Drivers product details from Texas Instruments stock available at XINJIADA

Manufacturer: Texas Instruments
Origchip NO: 815-CSD95492QVM
Package: 18-PowerTFDFN
Datasheet: -
Stock: 650
Description: CSD95492QVM datasheet pdf and PMIC - Full, Half-Bridge Drivers product details from Texas Instruments stock available at XINJIADA(Kg)

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Details

Tags

Parameters
Factory Lead Time	6 Weeks
Lifecycle Status	ACTIVE (Last Updated: 3 days ago)
Mounting Type	Surface Mount
Package / Case	18-PowerTFDFN
Surface Mount	YES
Number of Pins	18
Operating Temperature	-40°C~125°C TJ
Packaging	Tape & Reel (TR)
Series	NexFET™
JESD-609 Code	e3
Feature	Bootstrap Circuit
Pbfree Code	yes
Part Status	Active
Moisture Sensitivity Level (MSL)	2 (1 Year)
Number of Terminations	18
ECCN Code	EAR99
Terminal Finish	Matte Tin (Sn)
Applications	Synchronous Buck Converters
Additional Feature	OPERATES IN ADJUSTABLE MODE UP TO 5.5
Technology	Power MOSFET
Voltage - Supply	4.5V~5.5V
Terminal Position	DUAL
Terminal Form	NO LEAD
Number of Functions	1
Reach Compliance Code	not_compliant
Base Part Number	CSD95492
Input Voltage-Nom	12V
Interface	PWM
Analog IC - Other Type	SWITCHING REGULATOR
Output Configuration	Half Bridge (3)
Input Voltage (Min)	4.5V
Input Voltage (Max)	16V
Control Technique	PULSE WIDTH MODULATION
Voltage - Load	4.5V~16V
Current - Output / Channel	20A
Switching Frequency-Max	1250kHz
Fault Protection	Shoot-Through
Current - Peak Output	30A
Load Type	Inductive, Capacitive
Length	5mm
Width	4mm
Thickness	975μm
RoHS Status	ROHS3 Compliant

CSD95492QVM Description

The CSD95492QVM NexFET? power stage is a highly optimized design for use in a high-power, high-density synchronous buck converter. This product integrates the driver IC and power MOSFETs to complete the power stage switching function. This combination produces high-current, high-efficiency, and high-speed switching capability in a small 4-mm × 5-mm outline package. It also integrates the accurate current sensing and temperature sensing functionality to simplify system design and improve accuracy. In addition, the PCB footprint has been optimized to help reduce design time and simplify the completion of the overall system design.