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BGT24MTR11E6327XUMA1

BGT24MTR11E6327XUMA1 datasheet pdf and RF Misc ICs and Modules product details from Infineon Technologies stock available at Feilidi


  • Manufacturer: Infineon Technologies
  • Origchip NO: 376-BGT24MTR11E6327XUMA1
  • Package: 32-PowerVFQFN
  • Datasheet: PDF
  • Stock: 789
  • Description: BGT24MTR11E6327XUMA1 datasheet pdf and RF Misc ICs and Modules product details from Infineon Technologies stock available at Feilidi (Kg)

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Details

Tags

Parameters
Factory Lead Time 16 Weeks
Contact Plating Tin
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 32-PowerVFQFN
Packaging Tape & Reel (TR)
Published 2012
JESD-609 Code e3
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 32
Max Operating Temperature 150°C
Min Operating Temperature -40°C
HTS Code 8542.39.00.01
Max Power Dissipation 750mW
Technology BIPOLAR
Terminal Position QUAD
Terminal Form NO LEAD
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 3.3V
Terminal Pitch 0.5mm
Frequency 24GHz~26GHz
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code R-PQCC-N32
Function Transceiver
Operating Supply Voltage 3.3V
Temperature Grade INDUSTRIAL
Interface SPI
Max Supply Voltage 3.465V
Min Supply Voltage 3.135V
Nominal Supply Current 150mA
Gain 26 dB
Telecom IC Type TELECOM CIRCUIT
RF Type General Purpose
Max Junction Temperature (Tj) 150°C
Ambient Temperature Range High 105°C
Height 900μm
Length 5.5mm
Width 4.5mm
RoHS Status ROHS3 Compliant
Lead Free Lead Free
See Relate Datesheet
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