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72V3690L7-5BB

3.3V 144 Pin FIFO memory IC5 ns Min 3.15V VMax 3.45V V


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Shipping Cost

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Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.
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Details

Tags

Parameters
Factory Lead Time 7 Weeks
Contact Plating Lead, Tin
Mount Surface Mount
Package / Case BGA
Number of Pins 144
Published 2008
Part Status Active
Max Operating Temperature 70°C
Min Operating Temperature 0°C
Frequency 133.3MHz
Operating Supply Voltage 3.3V
Max Supply Voltage 3.45V
Min Supply Voltage 3.15V
Element Configuration Dual
Nominal Supply Current 40mA
Max Supply Current 40mA
Frequency (Max) 133.3MHz
Access Time 5 ns
Direction Unidirectional
Density 1.1 Mb
Sync/Async Synchronous
Word Size 36b
Bus Directional Unidirectional
Retransmit Capability Yes
FWFT Support Yes
Programmable Flags Support Yes
Length 13mm
Width 13mm
Thickness 1.76mm
RoHS Status RoHS Compliant
Lead Free Contains Lead

72V3690L7-5BB Overview


BGA is a package that contains FIFO memory chip.The recommended mounting method for this FIFO products is Surface Mount .In the case of the operation pins, they are 144 pins.In order to operate it, it requires 40mA volts of current.For FIFO's maximum efficiency, the supply voltage should be set to 3.3V .Keeping the temperature at 0°C degrees Celsius ensures its reliability.Its maximum operating temperature of 70°C °C ensures stable operation.FIFO may operate at very low supply voltages, such as 3.15V volts.An input voltage of 3.45V V is the maximum that FIFO memory can handle.A frequency of 133.3MHz is sufficient to maintain good accuracy.Regular operation has a FIFO memory's maximum value of 133.3MHz .

72V3690L7-5BB Features


Frequency at most

72V3690L7-5BB Applications


There are a lot of Integrated Device Technology (IDT) 72V3690L7-5BB FIFOs Memory applications.

  • Cameras
  • Microprogramming
  • Controlled baseline
  • IP Radio
  • Emulators
  • High-speed disk
  • Portable Information Devices
  • Thermal Management for DDR3 Memory Modules
  • Application that requires re-writable nonvolatile parameter memory
  • Programmable Logic Controller
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