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72V01L15JG

3.3V 32 Pin FIFO memory IC4kB15 ns Min 3V VMax 3.6V V


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FedEx International, 5-7 business days.

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Details

Tags

Parameters
Factory Lead Time 7 Weeks
Contact Plating Tin
Mount Surface Mount
Package / Case PLCC
Number of Pins 32
Published 2009
JESD-609 Code e3
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 1
ECCN Code EAR99
Max Operating Temperature 70°C
Min Operating Temperature 0°C
Pin Count 32
Operating Supply Voltage 3.3V
Number of Circuits 2
Max Supply Voltage 3.6V
Min Supply Voltage 3V
Memory Size 4kB
Element Configuration Dual
Nominal Supply Current 60mA
Max Supply Current 60mA
Frequency (Max) 40MHz
Access Time 15 ns
Data Bus Width 9b
Density 4.5 kb
Sync/Async Asynchronous
Word Size 9b
Bus Directional Unidirectional
Retransmit Capability Yes
FWFT Support No
Length 13.97mm
Width 11.43mm
Thickness 2.79mm
RoHS Status RoHS Compliant
Lead Free Lead Free

72V01L15JG Overview


FIFO memory chip is contained in the PLCC package.A FIFO chip's memory is 4kB , which may be used to store applications and data.Surface Mount is recommended as the mounting method.There are 32 pins for operation.In order for FIFO design to operate, FIFO design requires a maximum current of 60mA .When the supply voltage is set to 3.3V , the FIFO's maximum efficiency is achieved.It operates at 0°C degrees Celsius to ensure reliability.The stable operation is enabled by the memory logic's maximum operating temperature of 70°C °C.There is a possibility that FIFO may operate at a very low supply voltage, such as 3V V.FIFO memory is capable of handling a maximum supply voltage of 3.6V volts.A total of 32 pins are present on the FIFO memory IC.During regular operation, the FIFO memory's maximum value is 40MHz .Using 2 circuits allows for enhanced flexibility.

72V01L15JG Features


4kB memory size
Frequency at most

72V01L15JG Applications


There are a lot of Integrated Device Technology (IDT) 72V01L15JG FIFOs Memory applications.

  • Analog-to-digital converters
  • Data
  • Tape controllers
  • Rate buffers
  • Consumer
  • Fabrication Site
  • Seismic Data Collection at Extreme Temperatures
  • TVs
  • Game Consoles
  • Medical Monitoring Device
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