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67SLH080080080PI00

67SLH080080080PI00 datasheet pdf and RFI and EMI - Contacts, Fingerstock and Gaskets product details from Laird Technologies EMI stock available at XINJIADA

Manufacturer: Laird Technologies EMI
Origchip NO: 445-67SLH080080080PI00
Package: -
Datasheet: PDF
Stock: 598
Description: 67SLH080080080PI00 datasheet pdf and RFI and EMI - Contacts, Fingerstock and Gaskets product details from Laird Technologies EMI stock available at XINJIADA(Kg)

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FedEx International, 5-7 business days.

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Details

Tags

Parameters
Factory Lead Time	3 Weeks
Material	Polyurethane Foam, Tin-Copper Polyester (SN/CU)
Shape	Hourglass
Operating Temperature	-40°C~70°C
Packaging	Tape & Reel (TR)
Published	2015
Series	SMD Grounding Metallized
Part Status	Active
Moisture Sensitivity Level (MSL)	1 (Unlimited)
Type	Film Over Foam
Max Operating Temperature	158°C
Min Operating Temperature	-40°C
Attachment Method	Solder
Height	0.315 8.00mm
Length	0.315 8.00mm
Width	0.315 8.00mm
Thickness	8.001mm
RoHS Status	RoHS Compliant

67SLH080080080PI00 Overview

Contact RFI is packaged with materials from Polyurethane Foam, Tin-Copper Polyester (SN/CU).-40°C~70°C is a valid operating temperature for the EMI/RFI.In order to provide high reliability, advanced RFI and EMI contact' packaging Tape & Reel (TR) is used.At158°C, contacter RFI should run.Film Over Foam Type from the contacter RFI.As the name implies, this RFI EMI is a kind of the famous SMD Grounding Metallized series product line.