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67SLH060080080PI00

67SLH060080080PI00 datasheet pdf and RFI and EMI - Contacts, Fingerstock and Gaskets product details from Laird Technologies EMI stock available at XINJIADA

Manufacturer: Laird Technologies EMI
Origchip NO: 445-67SLH060080080PI00
Package: -
Datasheet: PDF
Stock: 518
Description: 67SLH060080080PI00 datasheet pdf and RFI and EMI - Contacts, Fingerstock and Gaskets product details from Laird Technologies EMI stock available at XINJIADA(Kg)

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FedEx International, 5-7 business days.

The following are some common countries' logistic time.
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Details

Tags

Parameters
Factory Lead Time	4 Weeks
Material	Polyurethane Foam, Tin-Copper Polyester (SN/CU)
Shape	Hourglass
Operating Temperature	-40°C~70°C
Packaging	Tape & Reel (TR)
Published	2015
Series	SMD Grounding Metallized
Part Status	Active
Moisture Sensitivity Level (MSL)	1 (Unlimited)
Type	Film Over Foam
Max Operating Temperature	158°C
Min Operating Temperature	-40°C
Attachment Method	Solder
Height	0.315 8.00mm
Length	0.315 8.00mm
Width	0.236 6.00mm
Thickness	8.001mm
RoHS Status	RoHS Compliant

67SLH060080080PI00 Overview

Contact RFI consists of materials from Polyurethane Foam, Tin-Copper Polyester (SN/CU).If the EMI/RFI is set to -40°C~70°C, it will work normally.The RFI and EMI contact' packaging Tape & Reel (TR) provides high reliability.Running the contacter RFI at 158°C is ideal.The contacter RFI type is Film Over Foam.As you can see, this RFI EMI comes from the well-known SMD Grounding Metallized series of products.