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67SLG100150100PI00

67SLG100150100PI00 datasheet pdf and RFI and EMI - Contacts, Fingerstock and Gaskets product details from Laird Technologies EMI stock available at XINJIADA

Manufacturer: Laird Technologies EMI
Origchip NO: 445-67SLG100150100PI00
Package: -
Datasheet: PDF
Stock: 731
Description: 67SLG100150100PI00 datasheet pdf and RFI and EMI - Contacts, Fingerstock and Gaskets product details from Laird Technologies EMI stock available at XINJIADA(Kg)

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FedEx International, 5-7 business days.

The following are some common countries' logistic time.
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Details

Tags

Parameters
Factory Lead Time	3 Weeks
Material	Polyurethane Foam, Tin-Copper Polyester (SN/CU)
Shape	Rectangle
Operating Temperature	-40°C~70°C
Packaging	Tape & Reel (TR)
Published	2015
Series	SMD Grounding Metallized
Part Status	Active
Moisture Sensitivity Level (MSL)	1 (Unlimited)
Type	Film Over Foam
Max Operating Temperature	158°C
Min Operating Temperature	-40°C
Attachment Method	Solder
Height	0.591 15.00mm
Length	0.394 10.00mm
Width	0.394 10.00mm
Thickness	15.0114mm
RoHS Status	RoHS Compliant

67SLG100150100PI00 Overview

Materials from Polyurethane Foam, Tin-Copper Polyester (SN/CU) are included in the Contact RFI.The EMI/RFI is capable of operating at the operating temperature of -40°C~70°C.Using advanced packaging techniques Tape & Reel (TR), high reliability is ensured.At a temperature around 158°C degrees Celsius, contacter RFI should be running.Film Over Foam Type from the contacter RFI.The RFI EMI that you are looking at comes from our well-known SMD Grounding Metallized series product line.