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67SLG040035030PI00

67SLG040035030PI00 datasheet pdf and RFI and EMI - Contacts, Fingerstock and Gaskets product details from Laird Technologies EMI stock available at XINJIADA

Manufacturer: Laird Technologies EMI
Origchip NO: 445-67SLG040035030PI00
Package: -
Datasheet: PDF
Stock: 219
Description: 67SLG040035030PI00 datasheet pdf and RFI and EMI - Contacts, Fingerstock and Gaskets product details from Laird Technologies EMI stock available at XINJIADA(Kg)

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Shipping Cost

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The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

Shipping Method

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Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.
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Details

Tags

Parameters
Factory Lead Time	4 Weeks
Material	Polyurethane Foam, Tin-Copper Polyester (SN/CU)
Shape	Rectangle
Operating Temperature	-40°C~70°C
Packaging	Tape & Reel (TR)
Published	2015
Series	SMD Grounding Metallized
Part Status	Active
Moisture Sensitivity Level (MSL)	1 (Unlimited)
Type	Film Over Foam
Max Operating Temperature	158°C
Min Operating Temperature	-40°C
Attachment Method	Solder
Height	0.138 3.50mm
Length	0.118 3.00mm
Width	0.157 4.00mm
Thickness	3.5052mm
RoHS Status	RoHS Compliant

67SLG040035030PI00 Overview

The Contact RFI contains materials from Polyurethane Foam, Tin-Copper Polyester (SN/CU).The EMI/RFI can work at -40°C~70°C.The RFI and EMI contact' packaging Tape & Reel (TR) provides high reliability.At a temperature around 158°C degrees Celsius, contacter RFI should be running.Film Over Foam contacter RFI type.RFI EMIs from the well-known SMD Grounding Metallized series product line are featured in this RFI EMI.