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3463-0002

3463-0002 datasheet pdf and Card Edge Connectors - Edgeboard Connectors product details from 3M stock available at XINJIADA


  • Manufacturer: 3M
  • Origchip NO: 2-3463-0002
  • Package: -
  • Datasheet: PDF
  • Stock: 868
  • Description: 3463-0002 datasheet pdf and Card Edge Connectors - Edgeboard Connectors product details from 3M stock available at XINJIADA(Kg)

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Details

Tags

Parameters
Factory Lead Time 5 Weeks
Contact Material Copper Alloy
Contact Plating Gold
Mount Flanges, Panel
Mounting Type Panel Mount
Housing Material Polybutylene
Weight 1.905088kg
Material - Insulation Polybutylene Terephthalate (PBT), Glass Filled
Operating Temperature -55°C~105°C
Packaging Bulk
Published 2007
Series 3000
Part Status Last Time Buy
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination IDC
Number of Positions 34
Max Operating Temperature 105°C
Min Operating Temperature -55°C
Color Gray
Number of Rows 2
Gender Female
Pitch 0.100 2.54mm
Orientation Right Angle
Contact Finish Gold
Lead Pitch 2.54mm
Number of Contacts 34
Housing Color Grey
Card Type Non Specified - Dual Edge
Read Out Dual
Number of Positions/Bay/Row 17
Flange Feature Flush Mount, Top Opening, Unthreaded, 0.125 (3.18mm) Dia
Max Current Rating 1A
Contact Finish Thickness 30.0μin 0.76μm
Card Thickness 0.054 ~ 0.070 1.37mm ~ 1.78mm
RoHS Status RoHS Compliant
Flammability Rating UL94 V-0
Lead Free Lead Free

3463-0002 Overview


Packaging was done per Bulk's specs.Type Panel Mount is recommended.In the 3000 field, the series of the device is indicated.For stable operation, a maximum operating temperature of 105°C°C should be considered.As a minimum, it must be operated at a temperature of -55°C degrees Celsius.

3463-0002 Features


3000 series

3463-0002 Applications


There are a lot of 3M 3463-0002 Edgeboard Connectors applications.

  • Digital Storage Oscilloscope
  • Uninterrupted Power Supplies
  • Communication Systems
  • Music reproduction technology
  • High Speed Data Acquisition for PCs
  • Scientific instruments
  • Scientific instruments.
  • Battery Operated Systems
  • Medical Instrumentation and medical imaging
  • Spectrum Analysis
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