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3413.0221.24

Fuse Chip Fast Acting 3.15A 32V SMD Solder Pad 1206 Glass Blister T/R

Manufacturer: Schurter Inc.
Origchip NO: 685-3413.0221.24
Package: 1206 (3216 Metric)
Datasheet: PDF
Stock: 558
Description: Fuse Chip Fast Acting 3.15A 32V SMD Solder Pad 1206 Glass Blister T/R(Kg)

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Details

Tags

Parameters
Mounting Type	Surface Mount
Package / Case	1206 (3216 Metric)
Terminal Shape	WRAPAROUND
Number of Pins	2
Housing Material	Glass
Weight	99.988768mg
Operating Temperature	-55°C~90°C
Packaging	Tape & Reel (TR)
Series	USI 1206
Size / Dimension	0.126Lx0.063W x 0.024 H 3.20mmx1.60mmx0.60mm
JESD-609 Code	e4
Pbfree Code	yes
Part Status	Active
Moisture Sensitivity Level (MSL)	Vendor Undefined
ECCN Code	EAR99
Resistance	17.2mOhm
Terminal Finish	Nickel/Gold (Ni/Au)
HTS Code	8536.10.00.40
Voltage - Rated DC	63V
Packing Method	BLISTER TAPE AND REEL
Depth	1.6mm
Current Rating	3.15A
Reference Standard	CCC; CSA; CUL; IEC; UL; VDE
Voltage - Rated AC	32V
Approval Agency	cURus, VDE
Max Voltage Rating (AC)	32V
Max Voltage Rating (DC)	63V
Response Time	Fast Blow
Fuse Type	Board Mount (Cartridge Style Excluded)
Breaking Capacity @ Rated Voltage	63A
Melting I2t	1.44
DC Cold Resistance	0.0172Ohm
Circuit Protection Type	ELECTRIC FUSE
Blow Characteristic	VERY FAST
Joule Integral-Nom	1 J
Pre-arcing Time-Min	1ms
Height	600μm
Radiation Hardening	No
RoHS Status	ROHS3 Compliant
Factory Lead Time	9 Weeks
Mount	Surface Mount